Stress, Microstructure and Materials Reliability of Sputter-Deposited Fe-N Films

P. B. Narayan; Y. K. Kim

doi:10.1109/20.333944

Stress, Microstructure and Materials Reliability of Sputter-Deposited Fe-N Films

P. B. Narayan, Y. K. Kim

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.

Original language	English
Pages (from-to)	3921-3923
Number of pages	3
Journal	IEEE Transactions on Magnetics
Volume	30
Issue number	6
DOIs	https://doi.org/10.1109/20.333944
Publication status	Published - 1994 Nov
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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abstract = "Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.",

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Stress, Microstructure and Materials Reliability of Sputter-Deposited Fe-N Films

Abstract

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