Stress, microstructure and materials reliability of sputter-deposited Fe-N films

P. B. Narayan, Young-geun Kim

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.

Original languageEnglish
Pages (from-to)3921-3923
Number of pages3
JournalIEEE Transactions on Magnetics
Volume30
Issue number6 pt 1
DOIs
Publication statusPublished - 1994 Nov 1
Externally publishedYes

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Physics and Astronomy (miscellaneous)

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