Stress, microstructure and materials reliability of sputter-deposited Fe-N films

P. B. Narayan, Young-geun Kim

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.

Original languageEnglish
Pages (from-to)3921-3923
Number of pages3
JournalIEEE Transactions on Magnetics
Volume30
Issue number6 pt 1
DOIs
Publication statusPublished - 1994 Nov 1
Externally publishedYes

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microstructure
Microstructure
reactivity
Compressive stress
contaminants
humidity
Magnetic properties
Atmospheric humidity
heat treatment
Nitrogen
manufacturing
Heat treatment
magnetic properties
nitrogen

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Physics and Astronomy (miscellaneous)

Cite this

Stress, microstructure and materials reliability of sputter-deposited Fe-N films. / Narayan, P. B.; Kim, Young-geun.

In: IEEE Transactions on Magnetics, Vol. 30, No. 6 pt 1, 01.11.1994, p. 3921-3923.

Research output: Contribution to journalArticle

@article{676751c932394979b8d04703ee0b97d5,
title = "Stress, microstructure and materials reliability of sputter-deposited Fe-N films",
abstract = "Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.",
author = "Narayan, {P. B.} and Young-geun Kim",
year = "1994",
month = "11",
day = "1",
doi = "10.1109/20.333944",
language = "English",
volume = "30",
pages = "3921--3923",
journal = "IEEE Transactions on Magnetics",
issn = "0018-9464",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "6 pt 1",

}

TY - JOUR

T1 - Stress, microstructure and materials reliability of sputter-deposited Fe-N films

AU - Narayan, P. B.

AU - Kim, Young-geun

PY - 1994/11/1

Y1 - 1994/11/1

N2 - Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.

AB - Sputtered Fe-N films with various nitrogen contents were investigated from the point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At the optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.

UR - http://www.scopus.com/inward/record.url?scp=0028548611&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028548611&partnerID=8YFLogxK

U2 - 10.1109/20.333944

DO - 10.1109/20.333944

M3 - Article

VL - 30

SP - 3921

EP - 3923

JO - IEEE Transactions on Magnetics

JF - IEEE Transactions on Magnetics

SN - 0018-9464

IS - 6 pt 1

ER -