Study on modified silicon surface after CHF3/C2F6 reactive ion etching

Hyung Ho Park, Kwang Ho Kwon, Sang Hwan Lee, Byung Hwa Koak, Sahn Nahm, Hee Tae Lee, Kyoung Ik Cho, Oh Joon Kwon, Young II Kang

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Abstract

The effects of reactive ion etching (RIE) of SiO2 layer in CHF3 / C2F6 on the underlying Si surface have been studied by X-ray photoelectron spectroscopy (XPS), secondary ion mass spectrometer, Rutherford backscattering spectroscopy, and high resolution transmission electron microscopy. We found that two distinguishable modified layers are formed by RIE: (i) a uniform residue surface layer of 4 nm thickness composed entirely of carbon, fluorine, oxygen, and hydrogen with 9 different kinds of chemical bonds and (ii) a contaminated silicon layer of about 50 nm thickness with carbon and fluorine atoms without any observable crystalline defects. To search the removal condition of the silicon surface residue, we monitored the changes of surface compositions for the etched silicon after various post treatments as rapid thermal anneal, O2, NF3, SF6, and Cl2 plasma treatments. XPS analysis revealed that NF3 treatment is most effective. With 10 seconds exposure to NF3 plasma, the fluorocarbon residue film decomposes. The remained fluorine completely disappears after the following wet cleaning.

Original languageEnglish
Pages (from-to)45-57
Number of pages13
JournalETRI Journal
Volume16
Issue number1
DOIs
Publication statusPublished - 1994

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Computer Science(all)
  • Electrical and Electronic Engineering

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    Park, H. H., Kwon, K. H., Lee, S. H., Koak, B. H., Nahm, S., Lee, H. T., Cho, K. I., Kwon, O. J., & Kang, Y. II. (1994). Study on modified silicon surface after CHF3/C2F6 reactive ion etching. ETRI Journal, 16(1), 45-57. https://doi.org/10.4218/etrij.94.0194.0014