Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC

Sang Myoung Lee, Seong Dae Park, Myong Jae Yoo, Woo Sung Lee, Nam Kee Kang, Sahn Nahm

Research output: Contribution to journalArticle

Abstract

Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

Original languageEnglish
Pages (from-to)157-161
Number of pages5
JournalJournal of the Korean Ceramic Society
Volume44
Issue number3
Publication statusPublished - 2007 Mar 1

Fingerprint

Ointments
Thick films
Linewidth
Powders
Lithography
Screen printing
Chemical analysis
Glass
Substrates

Keywords

  • Ag paste
  • Embedded inductor
  • LTCC
  • Thick film lithography

ASJC Scopus subject areas

  • Ceramics and Composites

Cite this

Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC. / Lee, Sang Myoung; Park, Seong Dae; Yoo, Myong Jae; Lee, Woo Sung; Kang, Nam Kee; Nahm, Sahn.

In: Journal of the Korean Ceramic Society, Vol. 44, No. 3, 01.03.2007, p. 157-161.

Research output: Contribution to journalArticle

Lee, Sang Myoung ; Park, Seong Dae ; Yoo, Myong Jae ; Lee, Woo Sung ; Kang, Nam Kee ; Nahm, Sahn. / Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC. In: Journal of the Korean Ceramic Society. 2007 ; Vol. 44, No. 3. pp. 157-161.
@article{549fffec3e16473e8a7cfa3c193d05b2,
title = "Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC",
abstract = "Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90{\%} yield.",
keywords = "Ag paste, Embedded inductor, LTCC, Thick film lithography",
author = "Lee, {Sang Myoung} and Park, {Seong Dae} and Yoo, {Myong Jae} and Lee, {Woo Sung} and Kang, {Nam Kee} and Sahn Nahm",
year = "2007",
month = "3",
day = "1",
language = "English",
volume = "44",
pages = "157--161",
journal = "Journal of the Korean Ceramic Society",
issn = "1229-7801",
publisher = "Korean Ceramic Society",
number = "3",

}

TY - JOUR

T1 - Study on the compositions of photosensitive Ag paste for patterning embedded fine-line inductor in LTCC

AU - Lee, Sang Myoung

AU - Park, Seong Dae

AU - Yoo, Myong Jae

AU - Lee, Woo Sung

AU - Kang, Nam Kee

AU - Nahm, Sahn

PY - 2007/3/1

Y1 - 2007/3/1

N2 - Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

AB - Line width under 100 μm with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However, combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of 30 μm with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

KW - Ag paste

KW - Embedded inductor

KW - LTCC

KW - Thick film lithography

UR - http://www.scopus.com/inward/record.url?scp=34247514804&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34247514804&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:34247514804

VL - 44

SP - 157

EP - 161

JO - Journal of the Korean Ceramic Society

JF - Journal of the Korean Ceramic Society

SN - 1229-7801

IS - 3

ER -