Abstract
The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
| Pages | 1935-1941 |
| Number of pages | 7 |
| Volume | PART C |
| Publication status | Published - 2006 Feb 23 |
| Event | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States Duration: 2005 Jul 17 → 2005 Jul 22 |
Other
| Other | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
|---|---|
| Country | United States |
| City | San Francisco, CA |
| Period | 05/7/17 → 05/7/22 |
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Keywords
- Ablation
- Flexible electronics
- Gold
- Inkjet
- Laser
- Nanoparticle
- Sintering
ASJC Scopus subject areas
- Engineering(all)
Cite this
Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics. / Ko, Seung Hwan; Chung, Jaewon; Choi, Yeonho; Hwang, David J.; Grigoropoulos, Costas P.; Poulikakos, Dimos.
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 1935-1941.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics
AU - Ko, Seung Hwan
AU - Chung, Jaewon
AU - Choi, Yeonho
AU - Hwang, David J.
AU - Grigoropoulos, Costas P.
AU - Poulikakos, Dimos
PY - 2006/2/23
Y1 - 2006/2/23
N2 - The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.
AB - The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.
KW - Ablation
KW - Flexible electronics
KW - Gold
KW - Inkjet
KW - Laser
KW - Nanoparticle
KW - Sintering
UR - http://www.scopus.com/inward/record.url?scp=32844472229&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=32844472229&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:32844472229
SN - 0791842002
SN - 9780791842003
VL - PART C
SP - 1935
EP - 1941
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
ER -