Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics

Seung Hwan Ko, Jaewon Chung, Yeonho Choi, David J. Hwang, Costas P. Grigoropoulos, Dimos Poulikakos

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Pages1935-1941
Number of pages7
VolumePART C
Publication statusPublished - 2006 Feb 23
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 2005 Jul 172005 Jul 22

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period05/7/1705/7/22

Fingerprint

Flexible electronics
Ink
Gold
Melting point
Lasers
Substrates
Processing
Laser heating
Polymers
Laser ablation
Pulsed lasers
Temperature
Computer aided design
Fabrication

Keywords

  • Ablation
  • Flexible electronics
  • Gold
  • Inkjet
  • Laser
  • Nanoparticle
  • Sintering

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Ko, S. H., Chung, J., Choi, Y., Hwang, D. J., Grigoropoulos, C. P., & Poulikakos, D. (2006). Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (Vol. PART C, pp. 1935-1941)

Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics. / Ko, Seung Hwan; Chung, Jaewon; Choi, Yeonho; Hwang, David J.; Grigoropoulos, Costas P.; Poulikakos, Dimos.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 1935-1941.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ko, SH, Chung, J, Choi, Y, Hwang, DJ, Grigoropoulos, CP & Poulikakos, D 2006, Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. vol. PART C, pp. 1935-1941, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, United States, 05/7/17.
Ko SH, Chung J, Choi Y, Hwang DJ, Grigoropoulos CP, Poulikakos D. Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C. 2006. p. 1935-1941
Ko, Seung Hwan ; Chung, Jaewon ; Choi, Yeonho ; Hwang, David J. ; Grigoropoulos, Costas P. ; Poulikakos, Dimos. / Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. pp. 1935-1941
@inproceedings{e4b9cea5a3594ae2ab24ddb461e3caf8,
title = "Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics",
abstract = "The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.",
keywords = "Ablation, Flexible electronics, Gold, Inkjet, Laser, Nanoparticle, Sintering",
author = "Ko, {Seung Hwan} and Jaewon Chung and Yeonho Choi and Hwang, {David J.} and Grigoropoulos, {Costas P.} and Dimos Poulikakos",
year = "2006",
month = "2",
day = "23",
language = "English",
isbn = "0791842002",
volume = "PART C",
pages = "1935--1941",
booktitle = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005",

}

TY - GEN

T1 - Subtractive laser processing of low temperature inkjet printed micro electric components of functional nano-ink for flexible electronics

AU - Ko, Seung Hwan

AU - Chung, Jaewon

AU - Choi, Yeonho

AU - Hwang, David J.

AU - Grigoropoulos, Costas P.

AU - Poulikakos, Dimos

PY - 2006/2/23

Y1 - 2006/2/23

N2 - The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.

AB - The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand(DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nano-particles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.

KW - Ablation

KW - Flexible electronics

KW - Gold

KW - Inkjet

KW - Laser

KW - Nanoparticle

KW - Sintering

UR - http://www.scopus.com/inward/record.url?scp=32844472229&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=32844472229&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:32844472229

SN - 0791842002

SN - 9780791842003

VL - PART C

SP - 1935

EP - 1941

BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

ER -