Technology development of silicon based CMOS tactile senor for robotics applications

Yong Kook Kim, Kunnyun Kim, Kang Ryeol Lee, Woo Sung Cho, Dae Sung Lee, Won Hyo Kim, Nam Kyu Cho, Kwang Bum Park, Hyo Derk Park, Jung Ho Park, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper describes the design, manufacture and measure of tactile sensor with piezoresistive detection of deflection. The tactile sensor array was constructed with a fully integrated complementary metal oxide semiconductor (CMOS) fabrication process and bulk micromachining for the sensing structures. Electrical connections were made between the flexible printed circuit boards (FPCB) and the sensor array module using an anisotropic conductive film (ACF) bonding. The individual sensor element has been shown to demonstrate linear responses to applied normal stress (117mV/N). Therefore, this approach could yield a highly sensitive tactile sensor array for use in dexterous robotic applications.

Original languageEnglish
Title of host publication2006 5th IEEE Conference on Sensors
Pages734-737
Number of pages4
DOIs
Publication statusPublished - 2006
Event2006 5th IEEE Conference on Sensors - Daegu, Korea, Republic of
Duration: 2006 Oct 222006 Oct 25

Publication series

NameProceedings of IEEE Sensors

Other

Other2006 5th IEEE Conference on Sensors
CountryKorea, Republic of
CityDaegu
Period06/10/2206/10/25

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Kim, Y. K., Kim, K., Lee, K. R., Cho, W. S., Lee, D. S., Kim, W. H., Cho, N. K., Park, K. B., Park, H. D., Park, J. H., & Ju, B. K. (2006). Technology development of silicon based CMOS tactile senor for robotics applications. In 2006 5th IEEE Conference on Sensors (pp. 734-737). [4178725] (Proceedings of IEEE Sensors). https://doi.org/10.1109/ICSENS.2007.355573