Temperature and oxygen partial pressure dependences of the surface tension of liquid Sn-Ag and Sn-Cu lead-free solder alloys

Joonho Lee, Wataru Shimoda, Toshihiro Tanaka

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Temperature dependence of the surface tension of liquid Sn-Ag and Sn-Cu base lead-free solder alloys and oxygen partial pressure dependence of liquid Sn-Ag alloy were evaluated using the experimental data obtained, respectively, by the constrained drop method and the sessile drop method in the previous studies [1, 2]. The temperature dependences of the surface tension have maximum positive values when the mol fraction of Ag and Cu is about 0.7, while those for pure liquid Sn, Ag, and Cu have negative values. The calculated values based on Butler's equations were found to be in reasonable agreement with those of the experimental data. The oxygen partial pressure dependences of the surface tension of liquid Sn-Ag alloys at 1253 K have a minimum value when the mol fraction of Ag is about 0.9 and the oxygen partial pressure is less than about 10-13 atm. From this, it is considered that the oxygen adsorption increased by adding Ag to Sn when the mol fraction of Ag is less than 0.9.

Original languageEnglish
Pages (from-to)1829-1834
Number of pages6
JournalMonatshefte fur Chemie
Volume136
Issue number11
DOIs
Publication statusPublished - 2005 Nov 1
Externally publishedYes

Fingerprint

Partial pressure
Surface tension
Oxygen
Liquids
Temperature
Adsorption
Lead-free solders

Keywords

  • Constrained drop method
  • Oxidation
  • Sn-Ag alloys
  • Sn-Cu alloys
  • Surface
  • Thermodynamics

ASJC Scopus subject areas

  • Chemistry(all)

Cite this

Temperature and oxygen partial pressure dependences of the surface tension of liquid Sn-Ag and Sn-Cu lead-free solder alloys. / Lee, Joonho; Shimoda, Wataru; Tanaka, Toshihiro.

In: Monatshefte fur Chemie, Vol. 136, No. 11, 01.11.2005, p. 1829-1834.

Research output: Contribution to journalArticle

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N2 - Temperature dependence of the surface tension of liquid Sn-Ag and Sn-Cu base lead-free solder alloys and oxygen partial pressure dependence of liquid Sn-Ag alloy were evaluated using the experimental data obtained, respectively, by the constrained drop method and the sessile drop method in the previous studies [1, 2]. The temperature dependences of the surface tension have maximum positive values when the mol fraction of Ag and Cu is about 0.7, while those for pure liquid Sn, Ag, and Cu have negative values. The calculated values based on Butler's equations were found to be in reasonable agreement with those of the experimental data. The oxygen partial pressure dependences of the surface tension of liquid Sn-Ag alloys at 1253 K have a minimum value when the mol fraction of Ag is about 0.9 and the oxygen partial pressure is less than about 10-13 atm. From this, it is considered that the oxygen adsorption increased by adding Ag to Sn when the mol fraction of Ag is less than 0.9.

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