Temperature dependence of surface tension of liquid Sn-Ag, In-Ag and In-Cu alloys

Joonho Lee, Wataru Shimoda, Toshihiro Tanaka

Research output: Contribution to journalArticle

33 Citations (Scopus)

Abstract

It is usually known that the surface tension of liquid metals and alloys decreases with increasing temperature, i.e., the temperature dependence of the surface tension is negative. We found, however, that some liquid alloys, which have large difference of the surface tension of pure components, show positive temperature dependence in certain composition ranges. Some Pb-free alloys, for which information on the surface tension is indispensable to be developed as environmental-friendly material, can be listed in this special category. The experimental results and the thermodynamic analysis of the temperature dependence of those alloys are discussed in the paper.

Original languageEnglish
Pages (from-to)438-442
Number of pages5
JournalMeasurement Science and Technology
Volume16
Issue number2
DOIs
Publication statusPublished - 2005 Feb 1
Externally publishedYes

Fingerprint

Temperature Dependence
Surface Tension
Surface tension
interfacial tension
Liquid
temperature dependence
liquid alloys
Liquids
liquids
Positive Dependence
Liquid Metal
Temperature
liquid metals
Liquid metals
Thermodynamics
Decrease
thermodynamics
Experimental Results
Chemical analysis
Range of data

Keywords

  • Constrained drop method
  • Density
  • Surface tension
  • Temperature dependence
  • Wetting diagnostics

ASJC Scopus subject areas

  • Polymers and Plastics
  • Ceramics and Composites
  • Materials Science (miscellaneous)

Cite this

Temperature dependence of surface tension of liquid Sn-Ag, In-Ag and In-Cu alloys. / Lee, Joonho; Shimoda, Wataru; Tanaka, Toshihiro.

In: Measurement Science and Technology, Vol. 16, No. 2, 01.02.2005, p. 438-442.

Research output: Contribution to journalArticle

Lee, Joonho ; Shimoda, Wataru ; Tanaka, Toshihiro. / Temperature dependence of surface tension of liquid Sn-Ag, In-Ag and In-Cu alloys. In: Measurement Science and Technology. 2005 ; Vol. 16, No. 2. pp. 438-442.
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