Temperature-Dependent Property Effects on Laminar Flow Characteristics in a Rectangular Microchannel

Ho Joon Park, Sang Young Son, Mun Cheol Choi, Geunbae Lim, In Seob Song, James Jungho Pak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)


This paper investigated experimentally effects of the temperature-dependent property on the laminar flow characteristics in the micro-channel, where water was used as a working fluid. A rectangular straight micro-channel was fabricated with the dimension of 57 μm (H) × 200 μm (W) × 48050 μm (L), in which the resistance temperature detectors (RTDs) were integrated to measure precise temperatures of the fluid directly on the inside-surface of the channel wall. A micro-heater was also installed at the outlet of the channel to generate the heat flux. We measured pressure drop by increasing mass flow rate and the applied heating power. At the same time, micro-Particle Image Velocimetry (micro-PIV) measured the detailed velocity fields along the microcharmel, where the wall temperature varied. Based on the pressure drop and Micro-PIV measurement, it was determined that the variation of the fluid property along the microchannel has an effect significantly on flow resistance but not considerably on the velocity profile. Also, it was observed that flow resistance and velocity field shows a good agreement with those estimated in the macro laminar theory under our experimental conditions.

Original languageEnglish
Title of host publicationMicro-Electro-Mechanical Systems (MEMS) - 2001
EditorsA.L. Lee, J. Simon, K. Breuer, S. Chen, R.S. Keynton, A. Malshe, J.-I. Mou, M. Dunn
Number of pages6
Publication statusPublished - 2001
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: 2001 Nov 112001 Nov 16

Publication series

NameAmerican Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)


Other2001 ASME International Mechanical Engineering Congress and Exposition
Country/TerritoryUnited States
CityNew York, NY

ASJC Scopus subject areas

  • Engineering(all)


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