Template-Guided Solution-Shearing Method for Enhanced Charge Carrier Mobility in Diketopyrrolopyrrole-Based Polymer Field-Effect Transistors

Jicheol Shin, Tae Ryang Hong, Tae Wan Lee, Aryeon Kim, Yun Ho Kim, Min Ju Cho, Dong Hoon Choi

Research output: Contribution to journalArticle

45 Citations (Scopus)

Abstract

Template-guided solution-shearing (TGSS) is used to fabricate field-effect transistors (FETs) composed of micropatterned prisms as active channels. The prisms comprise highly crystalline PTDPP-DTTE, in which diketopyrrolopyrrole (DPP) is flanked by thiophene. The FET has a maximum mobility of approximately 7.43 cm2 V-1 s-1, which is much higher than the mobility values of the thin-film transistors with solution-sheared or spin-coated films of PTDPP-DTTE annealed at 200 °C.

Original languageEnglish
Pages (from-to)6031-6035
Number of pages5
JournalAdvanced Materials
Volume26
Issue number34
DOIs
Publication statusPublished - 2014 Sep 1

Fingerprint

Carrier mobility
Field effect transistors
Prisms
Charge carriers
Shearing
Polymers
Thiophenes
Thiophene
Thin film transistors
Crystalline materials

Keywords

  • charge transport
  • conjugated polymers
  • diketopyrrolopyrrole
  • field-effect transistors
  • micro-patterning
  • organic electronics
  • polymer materials

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Template-Guided Solution-Shearing Method for Enhanced Charge Carrier Mobility in Diketopyrrolopyrrole-Based Polymer Field-Effect Transistors. / Shin, Jicheol; Hong, Tae Ryang; Lee, Tae Wan; Kim, Aryeon; Kim, Yun Ho; Cho, Min Ju; Choi, Dong Hoon.

In: Advanced Materials, Vol. 26, No. 34, 01.09.2014, p. 6031-6035.

Research output: Contribution to journalArticle

Shin, Jicheol ; Hong, Tae Ryang ; Lee, Tae Wan ; Kim, Aryeon ; Kim, Yun Ho ; Cho, Min Ju ; Choi, Dong Hoon. / Template-Guided Solution-Shearing Method for Enhanced Charge Carrier Mobility in Diketopyrrolopyrrole-Based Polymer Field-Effect Transistors. In: Advanced Materials. 2014 ; Vol. 26, No. 34. pp. 6031-6035.
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