Tensile and high cycle fatigue test of copper thin film

J. H. Park, J. H. An, Yun-Jae Kim, Y. H. Huh, H. J. Lee

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

This paper presents the results of tensile and high cycle fatigue tests for copper thin film. Copper films coated by Sn are often used in various electro devices. Especially, when the film is used in tape carrier package (TCP), the film is repeatedly exposed to mechanical or(and) thermal stresses which results often in the failure of the component. Therefore, to guarantee the reliability of the electrical devices using a film, tensile and fatigue characteristics of the film are important. In this study, to obtain the tensile and fatigue characteristics of the film, the specimen was fabricated by an etching process to make a smooth specimen of 2000 μm width, 8000 μm length and 15.26 μm thickness. The tensile and high cycle fatigue tests were performed with the specimen using the test machine developed by the authors. These specimens had measured values of Young's modulus (72 GPa) and a 0.2% offset yield and an ultimate strength of 358 MPa and 462 MPa, respectively. A closed-loop feedback control of the magnetic-electric actuator allowed loadcontrolled fatigue tests with 20 Hz frequency, in ambient environment and at two levels of mean stresses. The fatigue strength coefficient and exponent at 0.5 times of the ultimate tensile strength were 431 MPa and -0.0843, respectively. The fatigue strength coefficient and exponent at 0.6 times of the ultimate tensile strength were 371 MPa and -0.0923, respectively. The Goodman method is recommended when the fatigue life of thin film with mean stress will be estimated. The fatigue strength coefficient and exponent of copper thin film modified using Goodman method were 910 MPa and -0.0896, respectively.

Original languageEnglish
Pages (from-to)187-192
Number of pages6
JournalMaterialwissenschaft und Werkstofftechnik
Volume39
Issue number2
DOIs
Publication statusPublished - 2008 Feb 1

Fingerprint

fatigue tests
Copper
Fatigue of materials
Thin films
copper
cycles
thin films
exponents
tensile strength
Tensile strength
coefficients
Electric actuators
Magnetic actuators
fatigue life
thermal stresses
feedback control
Thermal stress
Tapes
tapes
Feedback control

Keywords

  • Copper
  • High cycle fatigue test
  • Mechanical properties
  • Tensile test
  • Thin film

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Tensile and high cycle fatigue test of copper thin film. / Park, J. H.; An, J. H.; Kim, Yun-Jae; Huh, Y. H.; Lee, H. J.

In: Materialwissenschaft und Werkstofftechnik, Vol. 39, No. 2, 01.02.2008, p. 187-192.

Research output: Contribution to journalArticle

Park, J. H. ; An, J. H. ; Kim, Yun-Jae ; Huh, Y. H. ; Lee, H. J. / Tensile and high cycle fatigue test of copper thin film. In: Materialwissenschaft und Werkstofftechnik. 2008 ; Vol. 39, No. 2. pp. 187-192.
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