Terahertz 3D Imaging with a 300-GHz CMOS Multi-Chip Array Detector

Kiryong Song, Doyoon Kim, Jungsoo Kim, Jai Heon Cho, Jae Sung Rieh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A 300-GHz 4×4 multi-chip detector array based on a 65-nm CMOS technology has been developed and successfully applied to 3D terahertz imaging. The detector array with a modular assembly consists of 16 single-chip detector arrays in 4×4 format, each single chip including 7×7 unit pixels. The resultant large pixel count of 971 (including the virtual pixels) with the multi-chip array allows single-shot 2D images without raster scan, enabling a rapid 3D terahertz imaging with a significantly reduced acquisition time. In this work, 3D images of a metallic bolt were successfully acquired at 300 GHz with the image setup that employs the developed multi-chip array as the detector.

Original languageEnglish
Title of host publicationRFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages239-240
Number of pages2
ISBN (Electronic)9781665466493
DOIs
Publication statusPublished - 2022
Event2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022 - Busan, Korea, Republic of
Duration: 2022 Aug 292022 Aug 31

Publication series

NameRFIT 2022 - 2022 IEEE International Symposium on Radio-Frequency Integration Technology

Conference

Conference2022 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2022
Country/TerritoryKorea, Republic of
CityBusan
Period22/8/2922/8/31

Keywords

  • CMOS integrated circuits
  • imaging
  • Semiconductor detectors
  • sensor arrays

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Signal Processing
  • Electrical and Electronic Engineering
  • Instrumentation

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