The application of a plastic diaphragm for a silicon micropump

In Byeong Kang, Mun Tak Son, Malcolm R. Haskard, Noel Samaan, Byeong Kwon Ju

Research output: Contribution to journalConference article

Abstract

The authors propose the use of a thin plastic film as a diaphragm for a silicon micropump. The plastic diaphragm allows large elastic deflection comprising a microsystem with corrosion resistant and low coefficient of friction. All aspects exploited through the development of a micropump with further advantages of eliminating several processing steps when compared with microdevices employing silicon as the thin vibrating element. Low viscosity epoxy resigns and 100 μ m polyethylene sticky tapes were used to overcome the relatively poor adhesion characteristics of plastics to silicon. The polyethylene sticky tape provides the weak bond onto a silicon wafer having microstructures fabricated by silicon bulk micromachining process. Type EPOFI 40200029 (Struers) low viscosity epoxy resin was used to obtain excellent sealing and high bonding strength between the silicon substrate and the plastic diaphragm. Low viscosity epoxy led to the deep penetration of the epoxy resulting in good sealing characteristics. The diaphragm and silicon micropump developed were tested with an external pneumatic actuator and showed excellent performance at pressures in the range of 0-30 psi.

Original languageEnglish
Pages (from-to)148-155
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3046
DOIs
Publication statusPublished - 1997 Jun 19
Externally publishedYes
EventSmart Structures and Materials 1997: Smart Electronics and MEMS - San Diego, United States
Duration: 1997 Mar 31997 Mar 6

Keywords

  • Epoxy
  • Micromachining
  • Micropump
  • Plastic diaphragm

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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