The biocompatibility of SLA-treated titanium implants.

Hyeongil Kim, Seong Ho Choi, Jae Jun Ryu, Seung Yong Koh, Ju Han Park, In Seop Lee

Research output: Contribution to journalArticle

69 Citations (Scopus)

Abstract

The titanium implant surface was sandblasted with large grits and acid etched (SLA) to increase the implant surface for osseointegration. The topography of the titanium surface was investigated with scanning electron microscopy (SEM) and a profilometer. The SLA implant demonstrated uniform small micro pits (1-2 microm in diameter). The values of average roughness (R(a)) and maximum height (R(t)) were 1.19 microm and 10.53 microm respectively after sandblasting and the acid-etching treatment. In the cell-surface interaction study, the human osteoblast cells grew well in vitro. The in vivo evaluation of the SLA implant placed in rabbit tibia showed good bone-to-implant contact (BIC) with a mean value of 29% in total length of the implant. In the short-term clinical study, SLA implants demonstrated good clinical performance, maintaining good crestal bone height.

Original languageEnglish
Number of pages1
JournalBiomedical materials (Bristol, England)
Volume3
Issue number2
DOIs
Publication statusPublished - 2008 Jun 1
Externally publishedYes

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Titanium
Biocompatibility
Osseointegration
Bone and Bones
Acids
Osteoblasts
Tibia
Cell Communication
Electron Scanning Microscopy
Bone
Rabbits
Topography
Etching
Surface roughness
Scanning electron microscopy
In Vitro Techniques
Clinical Studies

ASJC Scopus subject areas

  • Medicine(all)

Cite this

The biocompatibility of SLA-treated titanium implants. / Kim, Hyeongil; Choi, Seong Ho; Ryu, Jae Jun; Koh, Seung Yong; Park, Ju Han; Lee, In Seop.

In: Biomedical materials (Bristol, England), Vol. 3, No. 2, 01.06.2008.

Research output: Contribution to journalArticle

Kim, Hyeongil ; Choi, Seong Ho ; Ryu, Jae Jun ; Koh, Seung Yong ; Park, Ju Han ; Lee, In Seop. / The biocompatibility of SLA-treated titanium implants. In: Biomedical materials (Bristol, England). 2008 ; Vol. 3, No. 2.
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