The characteristics of joints with Indium-silver alloy using diffusion soldering method

Je Yoon Kim, Sang Won Park, Jee Young Yoon, Hwa Young Kim, Dae Yeon Lee, Gyu-Tae Kim, Man Young Sung, Ey Goo Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Bonding process using indium-silver alloy which can withstand high temperature was investigated at relatively low temperature. We used a thermal evaporator and vacuum coater for making indium-silver contact. From the result of experiment, we observed that indium and silver films which have good quality are formed. From phase diagram of In-Ag alloy, we can find that melting point of these compounds increases with the silver content, i.e. eutectic (1441°C) <AgIn 2 (166°C) < (300 °C) < (670°C) < (695°C). And these compounds are determined by the composition ratio of the source metal. Now we confirmed the thermal characteristics of Indium-Silver alloy is controlled by silver. Consequently we have developed Ag/In/Ag multi-layer composite which has higher melting point than that of normal contact. The melting point of Ag/In/Ag multi-layer is about 700 °C. The joint cross-sections are studied using SEM(scanning electron microscopy) and EDX(Energy Dispersive X-rays), From these data, we observed that the composition and microstructure of Ag/In/Ag multi-layer were reliable and this bonding procedure is a better technique compared to the conventional structure of quantum well LED and GaN/Si LED structure was made by using sapphire for substrate and might be good for high temperature electronic devices in the future.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsJ.H. Shin, M. Brongersma, C. Buchal, F. Priolo
Pages261-266
Number of pages6
Volume817
Publication statusPublished - 2004
EventNew Materials for Microphotonics - San Francisco, CA, United States
Duration: 2004 Apr 132004 Apr 15

Other

OtherNew Materials for Microphotonics
CountryUnited States
CitySan Francisco, CA
Period04/4/1304/4/15

Fingerprint

Indium alloys
Silver alloys
Soldering
Silver
Melting point
Indium
Light emitting diodes
Aluminum Oxide
Evaporators
Chemical analysis
Sapphire
Temperature
Eutectics
Semiconductor quantum wells
Phase diagrams
Metals
Vacuum
X rays
Microstructure
Scanning electron microscopy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Kim, J. Y., Park, S. W., Yoon, J. Y., Kim, H. Y., Lee, D. Y., Kim, G-T., ... Kang, E. G. (2004). The characteristics of joints with Indium-silver alloy using diffusion soldering method. In J. H. Shin, M. Brongersma, C. Buchal, & F. Priolo (Eds.), Materials Research Society Symposium - Proceedings (Vol. 817, pp. 261-266)

The characteristics of joints with Indium-silver alloy using diffusion soldering method. / Kim, Je Yoon; Park, Sang Won; Yoon, Jee Young; Kim, Hwa Young; Lee, Dae Yeon; Kim, Gyu-Tae; Sung, Man Young; Kang, Ey Goo.

Materials Research Society Symposium - Proceedings. ed. / J.H. Shin; M. Brongersma; C. Buchal; F. Priolo. Vol. 817 2004. p. 261-266.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, JY, Park, SW, Yoon, JY, Kim, HY, Lee, DY, Kim, G-T, Sung, MY & Kang, EG 2004, The characteristics of joints with Indium-silver alloy using diffusion soldering method. in JH Shin, M Brongersma, C Buchal & F Priolo (eds), Materials Research Society Symposium - Proceedings. vol. 817, pp. 261-266, New Materials for Microphotonics, San Francisco, CA, United States, 04/4/13.
Kim JY, Park SW, Yoon JY, Kim HY, Lee DY, Kim G-T et al. The characteristics of joints with Indium-silver alloy using diffusion soldering method. In Shin JH, Brongersma M, Buchal C, Priolo F, editors, Materials Research Society Symposium - Proceedings. Vol. 817. 2004. p. 261-266
Kim, Je Yoon ; Park, Sang Won ; Yoon, Jee Young ; Kim, Hwa Young ; Lee, Dae Yeon ; Kim, Gyu-Tae ; Sung, Man Young ; Kang, Ey Goo. / The characteristics of joints with Indium-silver alloy using diffusion soldering method. Materials Research Society Symposium - Proceedings. editor / J.H. Shin ; M. Brongersma ; C. Buchal ; F. Priolo. Vol. 817 2004. pp. 261-266
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abstract = "Bonding process using indium-silver alloy which can withstand high temperature was investigated at relatively low temperature. We used a thermal evaporator and vacuum coater for making indium-silver contact. From the result of experiment, we observed that indium and silver films which have good quality are formed. From phase diagram of In-Ag alloy, we can find that melting point of these compounds increases with the silver content, i.e. eutectic (1441°C) <AgIn 2 (166°C) < (300 °C) < (670°C) < (695°C). And these compounds are determined by the composition ratio of the source metal. Now we confirmed the thermal characteristics of Indium-Silver alloy is controlled by silver. Consequently we have developed Ag/In/Ag multi-layer composite which has higher melting point than that of normal contact. The melting point of Ag/In/Ag multi-layer is about 700 °C. The joint cross-sections are studied using SEM(scanning electron microscopy) and EDX(Energy Dispersive X-rays), From these data, we observed that the composition and microstructure of Ag/In/Ag multi-layer were reliable and this bonding procedure is a better technique compared to the conventional structure of quantum well LED and GaN/Si LED structure was made by using sapphire for substrate and might be good for high temperature electronic devices in the future.",
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