The characteristics of joints with Indium-silver alloy using diffusion soldering method

Je Yoon Kim, Sang Won Park, Jee Young Yoon, Hwa Young Kim, Dae Yeon Lee, Gyu-Tae Kim, Man Young Sung, Ey Goo Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)


Bonding process using indium-silver alloy which can withstand high temperature was investigated at relatively low temperature. We used a thermal evaporator and vacuum coater for making indium-silver contact. From the result of experiment, we observed that indium and silver films which have good quality are formed. From phase diagram of In-Ag alloy, we can find that melting point of these compounds increases with the silver content, i.e. eutectic (1441°C) <AgIn 2 (166°C) < (300 °C) < (670°C) < (695°C). And these compounds are determined by the composition ratio of the source metal. Now we confirmed the thermal characteristics of Indium-Silver alloy is controlled by silver. Consequently we have developed Ag/In/Ag multi-layer composite which has higher melting point than that of normal contact. The melting point of Ag/In/Ag multi-layer is about 700 °C. The joint cross-sections are studied using SEM(scanning electron microscopy) and EDX(Energy Dispersive X-rays), From these data, we observed that the composition and microstructure of Ag/In/Ag multi-layer were reliable and this bonding procedure is a better technique compared to the conventional structure of quantum well LED and GaN/Si LED structure was made by using sapphire for substrate and might be good for high temperature electronic devices in the future.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium - Proceedings
EditorsJ.H. Shin, M. Brongersma, C. Buchal, F. Priolo
Number of pages6
Publication statusPublished - 2004
EventNew Materials for Microphotonics - San Francisco, CA, United States
Duration: 2004 Apr 132004 Apr 15


OtherNew Materials for Microphotonics
CountryUnited States
CitySan Francisco, CA


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Kim, J. Y., Park, S. W., Yoon, J. Y., Kim, H. Y., Lee, D. Y., Kim, G-T., Sung, M. Y., & Kang, E. G. (2004). The characteristics of joints with Indium-silver alloy using diffusion soldering method. In J. H. Shin, M. Brongersma, C. Buchal, & F. Priolo (Eds.), Materials Research Society Symposium - Proceedings (Vol. 817, pp. 261-266)