The effect of electrode heat sink in organic-electronic devices

Sang Hun Choi, Tae Il Lee, Hong Koo Baik, Hee Hwan Roh, Ohmyoung Kwon, Dong Hak Suh

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28 Citations (Scopus)

Abstract

Most of organic devices showed poor thermal stability and short lifetime due to Joule heating by current injection during operation. To increase the lifetime of the devices, thermal management must be considered. We demonstrated the polymer light-emitting diodes with thermally conductive substrate and Al/Cu double cathode to enhance the thermal stability of the device. Also, we proposed the correlation between lifetime (Δt) and device heat sink (ΔT). The heat sink of all organic devices is required to enhance device durability.

Original languageEnglish
Article number183301
JournalApplied Physics Letters
Volume93
Issue number18
DOIs
Publication statusPublished - 2008

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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    Choi, S. H., Lee, T. I., Baik, H. K., Roh, H. H., Kwon, O., & Suh, D. H. (2008). The effect of electrode heat sink in organic-electronic devices. Applied Physics Letters, 93(18), [183301]. https://doi.org/10.1063/1.3021071