The effect of support resistance on the hydrogen permeation behavior in Pd-Cu-Ni ternary alloy membrane deposited on a porous nickel support

Shin Kun Ryi, Jong Soo Park, Sung Hyun Kim, Sung Ho Cho, Dong Won Kim

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

This paper shows the effect of support resistance on the pressure exponent. Pd-Cu-Ni ternary alloy film is formed on the newly developed porous nickel support which has Knudsen diffusion. Permeation flux of hydrogen was measured at 673, 723 and 773 K under two different permeation directions, i.e. support to film (SF mode) and film to support (FS mode). It was found that the permeation direction had an effect on the hydrogen permeation flux and the pressure exponent as well. For both of permeation directions, the interface pressure of Pd alloy film and porous nickel support was determined and it was affected by permeation direction. The obtained interface pressure was used to clarify the reason why the pressure exponent was deviated from the Sieverts' law and it was found that the reason is the support resistance rather than surface reaction.

Original languageEnglish
Pages (from-to)883-888
Number of pages6
JournalJournal of Membrane Science
Volume280
Issue number1-2
DOIs
Publication statusPublished - 2006 Sep 1

Fingerprint

Ternary alloys
ternary alloys
Nickel
Permeation
Hydrogen
nickel
membranes
Membranes
Pressure
hydrogen
exponents
Fluxes
surface reactions
Surface reactions
Direction compound

Keywords

  • Hydrogen
  • Knudsen diffusion
  • Permeation direction
  • Porous nickel support
  • Support resistance

ASJC Scopus subject areas

  • Filtration and Separation
  • Polymers and Plastics

Cite this

The effect of support resistance on the hydrogen permeation behavior in Pd-Cu-Ni ternary alloy membrane deposited on a porous nickel support. / Ryi, Shin Kun; Park, Jong Soo; Kim, Sung Hyun; Cho, Sung Ho; Kim, Dong Won.

In: Journal of Membrane Science, Vol. 280, No. 1-2, 01.09.2006, p. 883-888.

Research output: Contribution to journalArticle

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AU - Kim, Dong Won

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