The effect of thermally induced stress on device temperature measurements by Raman spectroscopy

Jihyun Kim, J. A. Freitas, P. B. Klein, S. Jang, F. Ren, S. J. Pearton

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

The effect of stress on the measured temperatures of a GaN Schottky diode is studied using micro-Raman scattering under passive and active heating. Our experiment shows that each specifie heteroepitaxial structure should be calibrated independently under passive heating conditions in order to minimize significant errors in the measurement of device temperature. This error is introduced by differences in biaxial strain (resulting from differences in lattice mismatch, thermal expansion coefficient, and relaxation) between the structure under investigation and that employed for calibration. Measurements of the operating temperature of a GaN Schottky diode indicated that a large error in temperature can result from the use of a temperature calibration from a different structure.

Original languageEnglish
Pages (from-to)G345-G347
JournalElectrochemical and Solid-State Letters
Volume8
Issue number12
DOIs
Publication statusPublished - 2005

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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