The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging

Steve H. Choi, Sehyun Shin, Young I. Cho

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio Dc/Dd (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5, 1.0, 2.0, and 4.0), the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, Dc/Dd, and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.

Original languageEnglish
Pages (from-to)607-617
Number of pages11
JournalInternational Communications in Heat and Mass Transfer
Volume20
Issue number5
Publication statusPublished - 1993 Sep 1
Externally publishedYes

Fingerprint

electronic packaging
Electronics packaging
liquid cooling
Reynolds number
flow distribution
modules
Channel flow
Cooling
Coolants
Liquids
headers
Flow rate
coolants
channel flow
Parallel flow
flow velocity
uniform flow
parallel flow

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Engineering(all)
  • Mechanical Engineering

Cite this

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