The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging

Steve H. Choi; Sehyun Shin; Young I. Cho

doi:10.1016/0735-1933(93)90073-5

The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging

Steve H. Choi, Sehyun Shin, Young I. Cho

Research output: Contribution to journal › Article › peer-review

30 Citations (Scopus)

Abstract

A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio D_c/D_d (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5, 1.0, 2.0, and 4.0), the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, D_c/D_d, and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.

Original language	English
Pages (from-to)	607-617
Number of pages	11
Journal	International Communications in Heat and Mass Transfer
Volume	20
Issue number	5
DOIs	https://doi.org/10.1016/0735-1933(93)90073-5
Publication status	Published - 1993
Externally published	Yes

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Chemical Engineering(all)
Condensed Matter Physics

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@article{981f5487624c432a8e151b907b9a5aaa,

title = "The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging",

abstract = "A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio Dc/Dd (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5, 1.0, 2.0, and 4.0), the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, Dc/Dd, and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.",

author = "Choi, {Steve H.} and Sehyun Shin and Cho, {Young I.}",

year = "1993",

doi = "10.1016/0735-1933(93)90073-5",

language = "English",

volume = "20",

pages = "607--617",

journal = "International Communications in Heat and Mass Transfer",

issn = "0735-1933",

publisher = "Elsevier Limited",

number = "5",

}

TY - JOUR

T1 - The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging

AU - Choi, Steve H.

AU - Shin, Sehyun

AU - Cho, Young I.

PY - 1993

Y1 - 1993

N2 - A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio Dc/Dd (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5, 1.0, 2.0, and 4.0), the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, Dc/Dd, and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.

AB - A uniform coolant distribution in the manifold of a liquid cooling module is necessary to eliminate local hot spots in electronic packaging. A numerical study was conducted to determine the effects of the Reynolds number and width ratio Dc/Dd (defined as the ratio of the combining header width to the dividing header width) on the coolant distribution in a parallel flow manifold. Of the four width ratios (0.5, 1.0, 2.0, and 4.0), the maximum channel flow rate to the minimum channel flow rate was 1.2. Regardless of the width ratio, the flow distribution is strongly dependent on the Reynolds number. It is concluded that a proper combination of the Reynolds number, Dc/Dd, and the area ratio, AR, is required to produce a uniform flow distribution in a manifold.

UR - http://www.scopus.com/inward/record.url?scp=0027657744&partnerID=8YFLogxK

U2 - 10.1016/0735-1933(93)90073-5

DO - 10.1016/0735-1933(93)90073-5

M3 - Article

AN - SCOPUS:0027657744

VL - 20

SP - 607

EP - 617

JO - International Communications in Heat and Mass Transfer

JF - International Communications in Heat and Mass Transfer

SN - 0735-1933

IS - 5

ER -

The effects of the Reynolds number and width ratio on the flow distribution in manifolds of liquid cooling modules for electronic packaging

Abstract

ASJC Scopus subject areas

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