The impact of liquid cooling on 3D multi-core processors

Hyung Beom Jang, Ikroh Yoon, Cheol Hong Kim, Seungwon Shin, Sung Woo Jung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

27 Citations (Scopus)

Abstract

Recently, 3D integration has been regarded as one of the most promising techniques due to its abilities of reducing global wire lengths and lowering power consumption. However, 3D integrated processors inevitably cause higher power density and lower thermal conductivity, since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Without an efficient cooling method inside the package, 3D integrated processors should suffer severe performance degradation by dynamic thermal management as well as reliability problems. In this paper, we analyze the impact of the liquid cooling on a 3D multi-core processor compared to the conventional air cooling. We also evaluate the leakage power consumption and the lifetime reliability depending on the temperature of each functional unit in the 3D multi-core processor. The simulation results show that the liquid cooling reduces the temperature of the Ll instruction cache (the hottest block in this evaluation) by as much as 45 degrees, resulting in 12.8% leakage reduction, on average, compared to the conventional air cooling. Moreover, the reduced temperature of the Ll instruction cache also improves the reliability of electromigration, stress migration, time-dependent dielectric breakdown, thermal cycling, and negative bias temperature instability significantly.

Original languageEnglish
Title of host publicationProceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors
Pages472-478
Number of pages7
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on Computer Design, ICCD 2009 - Lake Tahoe, CA, United States
Duration: 2009 Oct 42009 Oct 7

Other

Other2009 IEEE International Conference on Computer Design, ICCD 2009
CountryUnited States
CityLake Tahoe, CA
Period09/10/409/10/7

Fingerprint

Cooling
Liquids
Electric power utilization
Electromigration
Leakage (fluid)
Thermal cycling
Air
Electric breakdown
Temperature control
Temperature
Thermal conductivity
Wire
Degradation
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Jang, H. B., Yoon, I., Kim, C. H., Shin, S., & Jung, S. W. (2009). The impact of liquid cooling on 3D multi-core processors. In Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors (pp. 472-478). [5413115] https://doi.org/10.1109/ICCD.2009.5413115

The impact of liquid cooling on 3D multi-core processors. / Jang, Hyung Beom; Yoon, Ikroh; Kim, Cheol Hong; Shin, Seungwon; Jung, Sung Woo.

Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. 2009. p. 472-478 5413115.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jang, HB, Yoon, I, Kim, CH, Shin, S & Jung, SW 2009, The impact of liquid cooling on 3D multi-core processors. in Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors., 5413115, pp. 472-478, 2009 IEEE International Conference on Computer Design, ICCD 2009, Lake Tahoe, CA, United States, 09/10/4. https://doi.org/10.1109/ICCD.2009.5413115
Jang HB, Yoon I, Kim CH, Shin S, Jung SW. The impact of liquid cooling on 3D multi-core processors. In Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. 2009. p. 472-478. 5413115 https://doi.org/10.1109/ICCD.2009.5413115
Jang, Hyung Beom ; Yoon, Ikroh ; Kim, Cheol Hong ; Shin, Seungwon ; Jung, Sung Woo. / The impact of liquid cooling on 3D multi-core processors. Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. 2009. pp. 472-478
@inproceedings{8657dc218f184808b61538d7086eb72c,
title = "The impact of liquid cooling on 3D multi-core processors",
abstract = "Recently, 3D integration has been regarded as one of the most promising techniques due to its abilities of reducing global wire lengths and lowering power consumption. However, 3D integrated processors inevitably cause higher power density and lower thermal conductivity, since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Without an efficient cooling method inside the package, 3D integrated processors should suffer severe performance degradation by dynamic thermal management as well as reliability problems. In this paper, we analyze the impact of the liquid cooling on a 3D multi-core processor compared to the conventional air cooling. We also evaluate the leakage power consumption and the lifetime reliability depending on the temperature of each functional unit in the 3D multi-core processor. The simulation results show that the liquid cooling reduces the temperature of the Ll instruction cache (the hottest block in this evaluation) by as much as 45 degrees, resulting in 12.8{\%} leakage reduction, on average, compared to the conventional air cooling. Moreover, the reduced temperature of the Ll instruction cache also improves the reliability of electromigration, stress migration, time-dependent dielectric breakdown, thermal cycling, and negative bias temperature instability significantly.",
author = "Jang, {Hyung Beom} and Ikroh Yoon and Kim, {Cheol Hong} and Seungwon Shin and Jung, {Sung Woo}",
year = "2009",
month = "12",
day = "1",
doi = "10.1109/ICCD.2009.5413115",
language = "English",
isbn = "9781424450282",
pages = "472--478",
booktitle = "Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors",

}

TY - GEN

T1 - The impact of liquid cooling on 3D multi-core processors

AU - Jang, Hyung Beom

AU - Yoon, Ikroh

AU - Kim, Cheol Hong

AU - Shin, Seungwon

AU - Jung, Sung Woo

PY - 2009/12/1

Y1 - 2009/12/1

N2 - Recently, 3D integration has been regarded as one of the most promising techniques due to its abilities of reducing global wire lengths and lowering power consumption. However, 3D integrated processors inevitably cause higher power density and lower thermal conductivity, since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Without an efficient cooling method inside the package, 3D integrated processors should suffer severe performance degradation by dynamic thermal management as well as reliability problems. In this paper, we analyze the impact of the liquid cooling on a 3D multi-core processor compared to the conventional air cooling. We also evaluate the leakage power consumption and the lifetime reliability depending on the temperature of each functional unit in the 3D multi-core processor. The simulation results show that the liquid cooling reduces the temperature of the Ll instruction cache (the hottest block in this evaluation) by as much as 45 degrees, resulting in 12.8% leakage reduction, on average, compared to the conventional air cooling. Moreover, the reduced temperature of the Ll instruction cache also improves the reliability of electromigration, stress migration, time-dependent dielectric breakdown, thermal cycling, and negative bias temperature instability significantly.

AB - Recently, 3D integration has been regarded as one of the most promising techniques due to its abilities of reducing global wire lengths and lowering power consumption. However, 3D integrated processors inevitably cause higher power density and lower thermal conductivity, since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Without an efficient cooling method inside the package, 3D integrated processors should suffer severe performance degradation by dynamic thermal management as well as reliability problems. In this paper, we analyze the impact of the liquid cooling on a 3D multi-core processor compared to the conventional air cooling. We also evaluate the leakage power consumption and the lifetime reliability depending on the temperature of each functional unit in the 3D multi-core processor. The simulation results show that the liquid cooling reduces the temperature of the Ll instruction cache (the hottest block in this evaluation) by as much as 45 degrees, resulting in 12.8% leakage reduction, on average, compared to the conventional air cooling. Moreover, the reduced temperature of the Ll instruction cache also improves the reliability of electromigration, stress migration, time-dependent dielectric breakdown, thermal cycling, and negative bias temperature instability significantly.

UR - http://www.scopus.com/inward/record.url?scp=77950970853&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950970853&partnerID=8YFLogxK

U2 - 10.1109/ICCD.2009.5413115

DO - 10.1109/ICCD.2009.5413115

M3 - Conference contribution

AN - SCOPUS:77950970853

SN - 9781424450282

SP - 472

EP - 478

BT - Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

ER -