The impact of liquid cooling on 3D multi-core processors

Hyung Beom Jang, Ikroh Yoon, Cheol Hong Kim, Seungwon Shin, Sung Woo Jung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

29 Citations (Scopus)

Abstract

Recently, 3D integration has been regarded as one of the most promising techniques due to its abilities of reducing global wire lengths and lowering power consumption. However, 3D integrated processors inevitably cause higher power density and lower thermal conductivity, since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Without an efficient cooling method inside the package, 3D integrated processors should suffer severe performance degradation by dynamic thermal management as well as reliability problems. In this paper, we analyze the impact of the liquid cooling on a 3D multi-core processor compared to the conventional air cooling. We also evaluate the leakage power consumption and the lifetime reliability depending on the temperature of each functional unit in the 3D multi-core processor. The simulation results show that the liquid cooling reduces the temperature of the Ll instruction cache (the hottest block in this evaluation) by as much as 45 degrees, resulting in 12.8% leakage reduction, on average, compared to the conventional air cooling. Moreover, the reduced temperature of the Ll instruction cache also improves the reliability of electromigration, stress migration, time-dependent dielectric breakdown, thermal cycling, and negative bias temperature instability significantly.

Original languageEnglish
Title of host publicationProceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors
Pages472-478
Number of pages7
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 IEEE International Conference on Computer Design, ICCD 2009 - Lake Tahoe, CA, United States
Duration: 2009 Oct 42009 Oct 7

Other

Other2009 IEEE International Conference on Computer Design, ICCD 2009
CountryUnited States
CityLake Tahoe, CA
Period09/10/409/10/7

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Fingerprint Dive into the research topics of 'The impact of liquid cooling on 3D multi-core processors'. Together they form a unique fingerprint.

  • Cite this

    Jang, H. B., Yoon, I., Kim, C. H., Shin, S., & Jung, S. W. (2009). The impact of liquid cooling on 3D multi-core processors. In Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors (pp. 472-478). [5413115] https://doi.org/10.1109/ICCD.2009.5413115