The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique

Shin Kun Ryi; Jong Soo Park; Sung Hyun Kim; Sung Chang Hong; Dong Won Kim

doi:10.1016/j.desal.2006.03.302

The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique

Shin Kun Ryi, Jong Soo Park, Sung Hyun Kim, Sung Chang Hong, Dong Won Kim

Honorary professors

Research output: Contribution to journal › Article

4 Citations (Scopus)

Original language	English
Pages (from-to)	219-221
Number of pages	3
Journal	Desalination
Volume	200
Issue number	1-3
DOIs	https://doi.org/10.1016/j.desal.2006.03.302
Publication status	Published - 2006 Nov 20

ASJC Scopus subject areas

Chemistry(all)
Chemical Engineering(all)
Materials Science(all)
Water Science and Technology
Mechanical Engineering

Access to Document

10.1016/j.desal.2006.03.302

Cite this

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title = "The study of Pd-Cu-Ni membrane deposited on porous nickel support with Cu-reflow technique",

author = "Ryi, {Shin Kun} and Park, {Jong Soo} and Kim, {Sung Hyun} and Hong, {Sung Chang} and Kim, {Dong Won}",

year = "2006",

month = nov,

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doi = "10.1016/j.desal.2006.03.302",

language = "English",

volume = "200",

pages = "219--221",

journal = "Desalination",

issn = "0011-9164",

publisher = "Elsevier",

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AU - Ryi, Shin Kun

AU - Park, Jong Soo

AU - Kim, Sung Hyun

AU - Hong, Sung Chang

AU - Kim, Dong Won

PY - 2006/11/20

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DO - 10.1016/j.desal.2006.03.302

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SP - 219

EP - 221

JO - Desalination

JF - Desalination

SN - 0011-9164

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