Theoretical and experimental study on junction temperature of packaged Fabry-Perot laser diode

Jae Ho Han, S. W. Park

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

Characterization of laser diode at high temperature for the issue of long-term reliability to detect and screen the initial failures originated from internal stress and optical instability is performed. Estimation of junction temperature of 1.55 μm Fabry-Perot laser diode was theoretically approached by using thermal resistance of materials regarding the heat path from analytically modeling laser diode. Under the condition of burn-in test, experiments measuring the junction temperature with current injection at controlled temperature verify the result compared to that of analysis.

Original languageEnglish
Pages (from-to)292-294
Number of pages3
JournalIEEE Transactions on Device and Materials Reliability
Volume4
Issue number2
DOIs
Publication statusPublished - 2004 Jun
Externally publishedYes

Keywords

  • Laser reliability
  • Laser thermal factors
  • Semiconductor device packaging
  • Semiconductor lasers

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering

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