Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

Seunggun Yu; Do Kyun Kim; Cheolmin Park; Soon Man Hong; Chong Min Koo

doi:10.1007/s11164-013-1452-1

Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

Seunggun Yu, Do Kyun Kim, Cheolmin Park, Soon Man Hong, Chong Min Koo

Research output: Contribution to journal › Article › peer-review

17 Citations (Scopus)

Abstract

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.

Original language	English
Pages (from-to)	33-40
Number of pages	8
Journal	Research on Chemical Intermediates
Volume	40
Issue number	1
DOIs	https://doi.org/10.1007/s11164-013-1452-1
Publication status	Published - 2014 Jan
Externally published	Yes

Keywords

Boron nitride
Composites
Nylon 6,6
Silicon carbide
Thermal conductivity

ASJC Scopus subject areas

Chemistry(all)

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10.1007/s11164-013-1452-1

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title = "Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites",

abstract = "A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.",

keywords = "Boron nitride, Composites, Nylon 6,6, Silicon carbide, Thermal conductivity",

author = "Seunggun Yu and Kim, {Do Kyun} and Cheolmin Park and Hong, {Soon Man} and Koo, {Chong Min}",

note = "Funding Information: Acknowledgments This work was supported by a grant from the Fundamental R&D Program for Technology of World Premier Materials funded by the Ministry of Knowledge Economy (MKE) and was particlly supported by the Institute for Multi-disciplinary Convergence of Materials of the Korea Institute of Science and Technology (KIST) in the Republic of Korea.",

year = "2014",

month = jan,

doi = "10.1007/s11164-013-1452-1",

language = "English",

volume = "40",

pages = "33--40",

journal = "Research on Chemical Intermediates",

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T1 - Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

AU - Yu, Seunggun

AU - Kim, Do Kyun

AU - Park, Cheolmin

AU - Hong, Soon Man

AU - Koo, Chong Min

N1 - Funding Information: Acknowledgments This work was supported by a grant from the Fundamental R&D Program for Technology of World Premier Materials funded by the Ministry of Knowledge Economy (MKE) and was particlly supported by the Institute for Multi-disciplinary Convergence of Materials of the Korea Institute of Science and Technology (KIST) in the Republic of Korea.

PY - 2014/1

Y1 - 2014/1

N2 - A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.

AB - A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.

KW - Boron nitride

KW - Composites

KW - Nylon 6,6

KW - Silicon carbide

KW - Thermal conductivity

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U2 - 10.1007/s11164-013-1452-1

DO - 10.1007/s11164-013-1452-1

M3 - Article

AN - SCOPUS:84892796711

SN - 0922-6168

VL - 40

SP - 33

EP - 40

JO - Research on Chemical Intermediates

JF - Research on Chemical Intermediates

IS - 1

ER -

Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

Abstract

Keywords

ASJC Scopus subject areas

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