Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

Seunggun Yu, Do Kyun Kim, Cheolmin Park, Soon Man Hong, Chong Min Koo

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.

Original languageEnglish
Pages (from-to)33-40
Number of pages8
JournalResearch on Chemical Intermediates
Volume40
Issue number1
DOIs
Publication statusPublished - 2014 Jan 1
Externally publishedYes

Fingerprint

Fillers
Thermal conductivity
Composite materials
boron nitride
nylon 6
silicon carbide
Direction compound

Keywords

  • Boron nitride
  • Composites
  • Nylon 6,6
  • Silicon carbide
  • Thermal conductivity

ASJC Scopus subject areas

  • Chemistry(all)

Cite this

Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites. / Yu, Seunggun; Kim, Do Kyun; Park, Cheolmin; Hong, Soon Man; Koo, Chong Min.

In: Research on Chemical Intermediates, Vol. 40, No. 1, 01.01.2014, p. 33-40.

Research output: Contribution to journalArticle

Yu, Seunggun ; Kim, Do Kyun ; Park, Cheolmin ; Hong, Soon Man ; Koo, Chong Min. / Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites. In: Research on Chemical Intermediates. 2014 ; Vol. 40, No. 1. pp. 33-40.
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