TY - GEN
T1 - THERMAL DESIGN AND BATCH FABRICATION OF CANTILEVER PROBES FOR SCANNING THERMAL MICROSCOPY
AU - Shi, Li
AU - Kwon, Ohmyoung
AU - Wu, Guanghua
AU - Majumdar, Arunava
N1 - Funding Information:
The authors thank Dr. R. Russo of Lawrence Berkeley National Laboratory for support of the Ar’ laser facility for the experiment. This work is supported by the DOE Engineering Division - Basic Engineering Sciences and NSF Chemical and Transport Systems. The fabrication of the thermal probes have been carried out in the UC Berkeley Microfabrication Laboratory.
Funding Information:
The authors thank Dr. R. Russo of Lawrence Berkeley National Laboratory for support of the Ar' laser facility for the experiment. This work is supported by the DOE Engineering Division - Basic Engineering Sciences and NSF Chemical and Transport Systems. The fabrication of the thermal probes have been carried out in the UC Berkeley Microfabrication Laboratory.
Publisher Copyright:
© 1999 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1999
Y1 - 1999
N2 - Scanning thermal microscopy (SThM) has enabled direct observation of thermal phenomena at the nanometer scale. The superior spatial resolution makes SThM attractive for thermally probing electronic and optoelectronic devices as well as nanostructures. In the past, lack of thermal design of SThM probes led to inaccuracy and artifacts in the thermal images. Based on the knowledge of various tip-sample heat transfer mechanisms, this paper presents a one-dimensional model to estimate the temperature distribution in the probe tip. Based on the model, new thermal probes that have SiO2 tips, SiNx cantilevers, and Pt-Cr thermocouple junctions at the tip ends have been designed and fabricated. The fabrication process consists of only wafer-stage processing steps with more than 100 probes fabricated on a single wafer. The thermal probes have been successfully used for topographical imaging and to measure the intensity profile of a focused laser spot.
AB - Scanning thermal microscopy (SThM) has enabled direct observation of thermal phenomena at the nanometer scale. The superior spatial resolution makes SThM attractive for thermally probing electronic and optoelectronic devices as well as nanostructures. In the past, lack of thermal design of SThM probes led to inaccuracy and artifacts in the thermal images. Based on the knowledge of various tip-sample heat transfer mechanisms, this paper presents a one-dimensional model to estimate the temperature distribution in the probe tip. Based on the model, new thermal probes that have SiO2 tips, SiNx cantilevers, and Pt-Cr thermocouple junctions at the tip ends have been designed and fabricated. The fabrication process consists of only wafer-stage processing steps with more than 100 probes fabricated on a single wafer. The thermal probes have been successfully used for topographical imaging and to measure the intensity profile of a focused laser spot.
UR - http://www.scopus.com/inward/record.url?scp=0003055770&partnerID=8YFLogxK
U2 - 10.1115/IMECE1999-0251
DO - 10.1115/IMECE1999-0251
M3 - Conference contribution
AN - SCOPUS:0003055770
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 93
EP - 99
BT - Micro-Electro-Mechanical Systems (MEMS)
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Y2 - 14 November 1999 through 19 November 1999
ER -