Thermal Modeling and Validation of a Real-World Mobile AP

Young Ho Gong, Jae Jeong Yoo, Sung Woo Jung

Research output: Contribution to journalArticle

4 Citations (Scopus)
Original languageEnglish
Article number7904613
Pages (from-to)55-62
Number of pages8
JournalIEEE Design and Test
Volume35
Issue number1
DOIs
Publication statusPublished - 2018 Feb 1

Keywords

  • Mobile Application Processor
  • Package-on-Package
  • Temperature
  • Thermal Modeling

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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