Thermal modeling of Graphene layer on the peak channel temperature of AlGaNGaN high electron mobility transistors

Geunwoo Ko, Ji Hyun Kim

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

We report that the deposition of graphene as a heat spreading layer on AlGaNGaN /sapphire high electron mobility transistors (HEMT) can lower the temperature of localized hot spots, which can reach as high as 300°C. As the number of gate fingers increased, the peak channel temperature also increased. From our simulation, graphene was shown to be extremely effective in distributing the localized heat in both SiC and sapphire substrates. The reliability of AlGaNGaN HEMT can be remarkably improved by using a graphene layer because it can act as a heat-spreading layer and lower the temperature of localized hot spots, which are known to limit device performance and activate the formation of defects.

Original languageEnglish
JournalElectrochemical and Solid-State Letters
Volume12
Issue number2
DOIs
Publication statusPublished - 2009 Jan 1

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Graphite
High electron mobility transistors
high electron mobility transistors
Graphene
graphene
Aluminum Oxide
Sapphire
heat
sapphire
distributing
Temperature
temperature
Defects
defects
Substrates
Hot Temperature
simulation

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

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AB - We report that the deposition of graphene as a heat spreading layer on AlGaNGaN /sapphire high electron mobility transistors (HEMT) can lower the temperature of localized hot spots, which can reach as high as 300°C. As the number of gate fingers increased, the peak channel temperature also increased. From our simulation, graphene was shown to be extremely effective in distributing the localized heat in both SiC and sapphire substrates. The reliability of AlGaNGaN HEMT can be remarkably improved by using a graphene layer because it can act as a heat-spreading layer and lower the temperature of localized hot spots, which are known to limit device performance and activate the formation of defects.

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