Thermal residual stress analysis of soldering and lamination processes for fabrication of crystalline silicon photovoltaic modules

Mathematics

• Residual Stress 100%
• Residual Analysis 99%
• Thermal Stress 97%
• Silicon 95%
• Fabrication 94%
• Stress Analysis 90%
• Lamination 86%
• Wafer 78%
• Module 45%
• Decrease 14%
• Solar Cells 14%
• Mechanical Stress 14%
• Melting 11%
• Finite Element Model 10%
• Immediately 8%

Engineering & Materials Science

• Silicon wafers 82%
• Soldering 79%
• Crystalline materials 71%
• Stress analysis 69%
• Thermal stress 67%
• Residual stresses 59%
• Silicon 53%
• Fabrication 50%
• Busbars 44%
• Soldering alloys 22%
• Silicon solar cells 15%
• Melting point 12%
• Hot Temperature 5%