Thermally assisted nanotransfer printing with subi-20-nm resolution and 8-inch wafer scalability

Tae Wan Park, Myunghwan Byun, Hyunsung Jung, Gyu Rac Lee, Jae Hong Park, Hyun Ik Jang, Jung Woo Lee, Se Hun Kwon, Seungbum Hong, Jong Heun Lee, Yeon Sik Jung, Kwang Ho Kim, Woon Ik Park

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)


Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.

Original languageEnglish
Article numberabb6462
JournalScience Advances
Issue number31
Publication statusPublished - 2020 Jul

ASJC Scopus subject areas

  • General


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