Thermally stable Ti/Al-based ohmic contacts to N-polar n-GaN by using an indium interlayer

Sung Ki Kim, Jae Chun Han, Tae Yeon Seong

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The electrical properties of In/Ti/Al/Au contacts to N-polar n-GaN (nd = 5×1018cm%3) for high-power vertical light-emitting diodes were investigated at various thicknesses of the In layer, and compared with those of Ti/Al/Au contacts. Before annealing, both the Ti/Al/Au and In/Ti/Al/Au contacts were ohmic. After annealing at 300 C for 1 min, all of the samples exhibited some degradation of their electrical properties, although the In/Ti/Al/Au samples were more thermally stable. After annealing at 300 C for 60 min, the Ti/Al/Au contacts became non-ohmic, while the In (5 nm)/Ti/Al/Au contacts remained ohmic with a contact resistivity of 2.6×10%4?cm2. X-ray photoemission spectroscopy (XPS) results showed that, for all of the samples, annealing caused an increase in the content of interfacial oxygen. Based on the XPS and electrical results, the annealing dependence of the electrical characteristics of In/Ti/Al/Au contacts are described and discussed.

Original languageEnglish
Article number031001
JournalJapanese Journal of Applied Physics
Volume55
Issue number3
DOIs
Publication statusPublished - 2016 Mar 1

Fingerprint

Ohmic contacts
Indium
indium
electric contacts
interlayers
Annealing
annealing
Photoelectron spectroscopy
X ray spectroscopy
Electric properties
photoelectric emission
electrical properties
Light emitting diodes
spectroscopy
Degradation
Oxygen
x rays
light emitting diodes
degradation
electrical resistivity

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Thermally stable Ti/Al-based ohmic contacts to N-polar n-GaN by using an indium interlayer. / Kim, Sung Ki; Han, Jae Chun; Seong, Tae Yeon.

In: Japanese Journal of Applied Physics, Vol. 55, No. 3, 031001, 01.03.2016.

Research output: Contribution to journalArticle

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