Thermopower profiling across a silicon p-n junction through the 2ω signal measurement of AC current-heated tip-sample nano-contact

Kim Kyeongtae, Park Jisang, Ung Kim Sun, Oh Myoung Kwon, Sik Lee Joon, Ho Park Seung, Ki Choi Young

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thermopower profiling with nanometer resolution has important applications in the development of nano-structured high ZT thermoelectric materials and in dopant density profiling of nano-electronic devices. We suggested a new AC type thermopower measurement technique and demonstrated it with a simple experimental setup. Thermopower distribution across a silicon p-n junction was measured point-by-point at every 10 nm free from the noises due to built-in potential andphoto-ionization effect and compared with theoretical result. Although this new AC type thermopower measurement technique could not follow the sharp variation of the theoretical thermopower near the p-n junction, it could identify a smooth peak of thermopower distribution in the depletion layer of the p-n junction.

Original languageEnglish
Title of host publication1st International Conference on Thermal Issues in Emerging Technologies, Theory and Applications; Proceedings - ThETA1
Pages177-181
Number of pages5
DOIs
Publication statusPublished - 2007 Dec 17
Event1st International Conference on Thermal Issues in Emerging Technologies, Theory and Applications; Proceedings - ThETA1 - Cairo, Egypt
Duration: 2007 Jan 32007 Jan 6

Other

Other1st International Conference on Thermal Issues in Emerging Technologies, Theory and Applications; Proceedings - ThETA1
CountryEgypt
CityCairo
Period07/1/307/1/6

ASJC Scopus subject areas

  • Energy Engineering and Power Technology

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    Kyeongtae, K., Jisang, P., Sun, U. K., Kwon, O. M., Joon, S. L., Seung, H. P., & Young, K. C. (2007). Thermopower profiling across a silicon p-n junction through the 2ω signal measurement of AC current-heated tip-sample nano-contact. In 1st International Conference on Thermal Issues in Emerging Technologies, Theory and Applications; Proceedings - ThETA1 (pp. 177-181). [4211115] https://doi.org/10.1109/THETA.2007.363437