Thickness controlled and smooth polycrystalline CVD diamond film deposition on SiO2 with electrostatic self assembly seeding process

J. H. Kim, S. K. Lee, O. M. Kwon, S. I. Hong, D. S. Lim

Research output: Contribution to journalArticlepeer-review

28 Citations (Scopus)


Sub micrometer thick continuous CVD diamond film was synthesized on thermally grown SiO2 film employing the electrostatic self assembly seeding with nano-meter sized ultra dispersed diamond particles. Hot filament CVD system was used to deposit diamond film. Formation of mono-dispersed and mono-layered nano diamond seeding layer by well-known Electrostatic Self-Assembly method was effective to increase density and homogeneity of seeding particles. Because of high density of uniformed seeding particles, the nm controlled continuous CVD films with the surface roughness of less than 13 nm on silicon oxide without any mechanical damage were obtained. Linear growth rate with short incubation time was also observed. Depending on the film thickness, coloring effect was observed ranging from blue to yellow and orange. There was no visible fringe on the coated surface which affirms the good thickness uniformity.

Original languageEnglish
Pages (from-to)1218-1222
Number of pages5
JournalDiamond and Related Materials
Issue number10
Publication statusPublished - 2009 Oct


  • Electrostatic self assembly
  • Hot filament CVD
  • Nano diamond
  • Thickness control

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Chemistry(all)
  • Mechanical Engineering
  • Materials Chemistry
  • Electrical and Electronic Engineering


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