Thin PDP packaging technology by direct-joint method

Duck Jung Lee, Byeong Kwon Ju, Yun-Hi Lee, Yun Kwon Park, Jun Dong Kim, Gwon J. Moon, Jin Jang, Myung Hwan Oh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We suggested a new PDP packaging technology using the direct joint method, which need not an exhausting hole and tube, and provide a simple, short time process and thin panel. To packaging, we formed the lumps on seal line to pumping-out path and performed a pretreatment of glass frit. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 cd/m 2.

Original languageEnglish
Title of host publicationSID Conference Record of the International Display Research Conference
Pages965-968
Number of pages4
Publication statusPublished - 2001
Externally publishedYes
EventAsia Display/IDW 2001 - Nagoya, Japan
Duration: 2002 Oct 162002 Oct 19

Other

OtherAsia Display/IDW 2001
CountryJapan
CityNagoya
Period02/10/1602/10/19

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Lee, D. J., Ju, B. K., Lee, Y-H., Park, Y. K., Kim, J. D., Moon, G. J., Jang, J., & Oh, M. H. (2001). Thin PDP packaging technology by direct-joint method. In SID Conference Record of the International Display Research Conference (pp. 965-968)