Thin PDP packaging technology by direct-joint method

Duck Jung Lee, Byeong Kwon Ju, Yun Hi Lee, Yun Kwon Park, Jun Dong Kim, Gwon Jin Moon, Jin Jang, Myung Hwan Oh

Research output: Contribution to journalConference article

Abstract

We suggested a new PDP packaging technology using the direct joint method, which need not an exhausting hole and tube, and provide a simple, short time process and thin panel. To packaging, we formed the lumps on seal line to pumping-out path and performed a pretreatment of glass frit. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 cd/m2.

Original languageEnglish
Pages (from-to)965-968
Number of pages4
JournalSID Conference Record of the International Display Research Conference
Publication statusPublished - 2001
EventAsia Display/IDW 2001 - Nagoya, Japan
Duration: 2002 Oct 162002 Oct 19

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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