Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories

Tae Seon Kim, Soo-Won Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents a method of improving the signal integrity of the universal serial bus (USB) by analyzing transmission line impedance. There are many accessories for smartphones in the marketplace due to the recent fast proliferation of smartphones. Some of these accessories have data sync functions to connect smartphones with host-like computers. Currently, most smartphones comply with USB2.0 high-speed (HS) specification for the data sync. Signals for USB2.0 HS in smartphones are extremely vulnerable to mismatched impedance when adding peripheral electronic parts such as switches, capacitors, transmission lines, etc. However, because the accessories supporting data sync are made of printed circuit boards (PCB), flexible printed circuit boards (FPCB), or both, if the transmission line impedance is designed carelessly, USB communication will not operate. This paper presents a transmission line impedance design for USB2.0 HS signals in Power Pack that is a portable charging device accessory for the Samsung Galaxy S. This device was assembled using connected PCB and FPCB because of its sleek design and hence was more vulnerable to impedance mismatch. This paper simulated PCB signal integrity and impedance design with Si8000, developed by Polar Instruments, and was verified with USB-HS eye-diagrams in the time domain.

Original languageEnglish
Title of host publication2012 International Symposium on Communications and Information Technologies, ISCIT 2012
Pages122-126
Number of pages5
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 International Symposium on Communications and Information Technologies, ISCIT 2012 - Gold Coast, QLD, Australia
Duration: 2012 Oct 22012 Oct 5

Other

Other2012 International Symposium on Communications and Information Technologies, ISCIT 2012
CountryAustralia
CityGold Coast, QLD
Period12/10/212/10/5

Fingerprint

Smartphones
Accessories
Printed circuit boards
Electric lines
Galaxies
Capacitors
Switches
Specifications
Communication

Keywords

  • Eye-diagrams
  • FPCB
  • PCB
  • portable charging application accessory
  • Signal integrity
  • smartphone
  • USB-HS

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Information Systems

Cite this

Kim, T. S., & Kim, S-W. (2012). Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories. In 2012 International Symposium on Communications and Information Technologies, ISCIT 2012 (pp. 122-126). [6380874] https://doi.org/10.1109/ISCIT.2012.6380874

Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories. / Kim, Tae Seon; Kim, Soo-Won.

2012 International Symposium on Communications and Information Technologies, ISCIT 2012. 2012. p. 122-126 6380874.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, TS & Kim, S-W 2012, Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories. in 2012 International Symposium on Communications and Information Technologies, ISCIT 2012., 6380874, pp. 122-126, 2012 International Symposium on Communications and Information Technologies, ISCIT 2012, Gold Coast, QLD, Australia, 12/10/2. https://doi.org/10.1109/ISCIT.2012.6380874
Kim TS, Kim S-W. Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories. In 2012 International Symposium on Communications and Information Technologies, ISCIT 2012. 2012. p. 122-126. 6380874 https://doi.org/10.1109/ISCIT.2012.6380874
Kim, Tae Seon ; Kim, Soo-Won. / Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories. 2012 International Symposium on Communications and Information Technologies, ISCIT 2012. 2012. pp. 122-126
@inproceedings{56f5fc2de45c4cdd9fb6ebb25415101e,
title = "Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories",
abstract = "This paper presents a method of improving the signal integrity of the universal serial bus (USB) by analyzing transmission line impedance. There are many accessories for smartphones in the marketplace due to the recent fast proliferation of smartphones. Some of these accessories have data sync functions to connect smartphones with host-like computers. Currently, most smartphones comply with USB2.0 high-speed (HS) specification for the data sync. Signals for USB2.0 HS in smartphones are extremely vulnerable to mismatched impedance when adding peripheral electronic parts such as switches, capacitors, transmission lines, etc. However, because the accessories supporting data sync are made of printed circuit boards (PCB), flexible printed circuit boards (FPCB), or both, if the transmission line impedance is designed carelessly, USB communication will not operate. This paper presents a transmission line impedance design for USB2.0 HS signals in Power Pack that is a portable charging device accessory for the Samsung Galaxy S. This device was assembled using connected PCB and FPCB because of its sleek design and hence was more vulnerable to impedance mismatch. This paper simulated PCB signal integrity and impedance design with Si8000, developed by Polar Instruments, and was verified with USB-HS eye-diagrams in the time domain.",
keywords = "Eye-diagrams, FPCB, PCB, portable charging application accessory, Signal integrity, smartphone, USB-HS",
author = "Kim, {Tae Seon} and Soo-Won Kim",
year = "2012",
month = "12",
day = "1",
doi = "10.1109/ISCIT.2012.6380874",
language = "English",
isbn = "9781467311571",
pages = "122--126",
booktitle = "2012 International Symposium on Communications and Information Technologies, ISCIT 2012",

}

TY - GEN

T1 - Transmission line impedance design for USB2.0 high-speed signals of smartphone accessories

AU - Kim, Tae Seon

AU - Kim, Soo-Won

PY - 2012/12/1

Y1 - 2012/12/1

N2 - This paper presents a method of improving the signal integrity of the universal serial bus (USB) by analyzing transmission line impedance. There are many accessories for smartphones in the marketplace due to the recent fast proliferation of smartphones. Some of these accessories have data sync functions to connect smartphones with host-like computers. Currently, most smartphones comply with USB2.0 high-speed (HS) specification for the data sync. Signals for USB2.0 HS in smartphones are extremely vulnerable to mismatched impedance when adding peripheral electronic parts such as switches, capacitors, transmission lines, etc. However, because the accessories supporting data sync are made of printed circuit boards (PCB), flexible printed circuit boards (FPCB), or both, if the transmission line impedance is designed carelessly, USB communication will not operate. This paper presents a transmission line impedance design for USB2.0 HS signals in Power Pack that is a portable charging device accessory for the Samsung Galaxy S. This device was assembled using connected PCB and FPCB because of its sleek design and hence was more vulnerable to impedance mismatch. This paper simulated PCB signal integrity and impedance design with Si8000, developed by Polar Instruments, and was verified with USB-HS eye-diagrams in the time domain.

AB - This paper presents a method of improving the signal integrity of the universal serial bus (USB) by analyzing transmission line impedance. There are many accessories for smartphones in the marketplace due to the recent fast proliferation of smartphones. Some of these accessories have data sync functions to connect smartphones with host-like computers. Currently, most smartphones comply with USB2.0 high-speed (HS) specification for the data sync. Signals for USB2.0 HS in smartphones are extremely vulnerable to mismatched impedance when adding peripheral electronic parts such as switches, capacitors, transmission lines, etc. However, because the accessories supporting data sync are made of printed circuit boards (PCB), flexible printed circuit boards (FPCB), or both, if the transmission line impedance is designed carelessly, USB communication will not operate. This paper presents a transmission line impedance design for USB2.0 HS signals in Power Pack that is a portable charging device accessory for the Samsung Galaxy S. This device was assembled using connected PCB and FPCB because of its sleek design and hence was more vulnerable to impedance mismatch. This paper simulated PCB signal integrity and impedance design with Si8000, developed by Polar Instruments, and was verified with USB-HS eye-diagrams in the time domain.

KW - Eye-diagrams

KW - FPCB

KW - PCB

KW - portable charging application accessory

KW - Signal integrity

KW - smartphone

KW - USB-HS

UR - http://www.scopus.com/inward/record.url?scp=84872135488&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84872135488&partnerID=8YFLogxK

U2 - 10.1109/ISCIT.2012.6380874

DO - 10.1109/ISCIT.2012.6380874

M3 - Conference contribution

SN - 9781467311571

SP - 122

EP - 126

BT - 2012 International Symposium on Communications and Information Technologies, ISCIT 2012

ER -