Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong, Byeong Kwon Ju, D. J. Lee, Yun-Hi Lee, N. Y. Lee, Y. W. Ko, Y. G. Moon, D. J. Choi, M. H. Oh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10 -7 torr vacuum level.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Vacuum Microelectronics Conference, IVMC
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages42-45
Number of pages4
Publication statusPublished - 1998 Dec 1
Externally publishedYes
EventProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC - Asheville, NC, USA
Duration: 1998 Jul 191998 Jul 24

Other

OtherProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC
CityAsheville, NC, USA
Period98/7/1998/7/24

Fingerprint

electrostatic bonding
packaging
field emission
glass
exhausting
vacuum
sealing
silicon films
amorphous silicon
emitters
sputtering

ASJC Scopus subject areas

  • Surfaces and Interfaces

Cite this

Jeong, J. W., Ju, B. K., Lee, D. J., Lee, Y-H., Lee, N. Y., Ko, Y. W., ... Oh, M. H. (1998). Tubeless packaging of field emission display using glass to glass electrostatic bonding technology. In Proceedings of the IEEE International Vacuum Microelectronics Conference, IVMC (pp. 42-45). Piscataway, NJ, United States: IEEE.

Tubeless packaging of field emission display using glass to glass electrostatic bonding technology. / Jeong, J. W.; Ju, Byeong Kwon; Lee, D. J.; Lee, Yun-Hi; Lee, N. Y.; Ko, Y. W.; Moon, Y. G.; Choi, D. J.; Oh, M. H.

Proceedings of the IEEE International Vacuum Microelectronics Conference, IVMC. Piscataway, NJ, United States : IEEE, 1998. p. 42-45.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jeong, JW, Ju, BK, Lee, DJ, Lee, Y-H, Lee, NY, Ko, YW, Moon, YG, Choi, DJ & Oh, MH 1998, Tubeless packaging of field emission display using glass to glass electrostatic bonding technology. in Proceedings of the IEEE International Vacuum Microelectronics Conference, IVMC. IEEE, Piscataway, NJ, United States, pp. 42-45, Proceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC, Asheville, NC, USA, 98/7/19.
Jeong JW, Ju BK, Lee DJ, Lee Y-H, Lee NY, Ko YW et al. Tubeless packaging of field emission display using glass to glass electrostatic bonding technology. In Proceedings of the IEEE International Vacuum Microelectronics Conference, IVMC. Piscataway, NJ, United States: IEEE. 1998. p. 42-45
Jeong, J. W. ; Ju, Byeong Kwon ; Lee, D. J. ; Lee, Yun-Hi ; Lee, N. Y. ; Ko, Y. W. ; Moon, Y. G. ; Choi, D. J. ; Oh, M. H. / Tubeless packaging of field emission display using glass to glass electrostatic bonding technology. Proceedings of the IEEE International Vacuum Microelectronics Conference, IVMC. Piscataway, NJ, United States : IEEE, 1998. pp. 42-45
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