Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong, Byeong Kwon Ju, D. J. Lee, Yun-Hi Lee, N. Y. Lee, Y. W. Ko, Y. G. Moon, D. J. Choi, M. H. Oh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10 -7 torr vacuum level.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Vacuum Microelectronics Conference, IVMC
Place of PublicationPiscataway, NJ, United States
PublisherIEEE
Pages42-45
Number of pages4
Publication statusPublished - 1998 Dec 1
Externally publishedYes
EventProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC - Asheville, NC, USA
Duration: 1998 Jul 191998 Jul 24

Other

OtherProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC
CityAsheville, NC, USA
Period98/7/1998/7/24

ASJC Scopus subject areas

  • Surfaces and Interfaces

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  • Cite this

    Jeong, J. W., Ju, B. K., Lee, D. J., Lee, Y-H., Lee, N. Y., Ko, Y. W., Moon, Y. G., Choi, D. J., & Oh, M. H. (1998). Tubeless packaging of field emission display using glass to glass electrostatic bonding technology. In Proceedings of the IEEE International Vacuum Microelectronics Conference, IVMC (pp. 42-45). IEEE.