Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong, B. K. Ju, D. J. Lee, Y. H. Lee, N. Y. Lee, Y. W. Ko, Y. G. Moon, D. J. Choi, M. H. Oh

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Abstract

Glass-to-glass electrostatic bonding has been developed for tubeless packaging of field emitter arrays (FEAs). Amorphous silicon film was deposited on #0080 glass by means of RF sputtering method. In order to investigate the applicability of this bonding technique to in-situ vacuum packaging of FED, the hermetic sealing test of FED panel whose exhausting hole was sealed by this technique was accomplished under 10-7 torr vacuum level.

Original languageEnglish
Pages42-45
Number of pages4
Publication statusPublished - 1998
EventProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC - Asheville, NC, USA
Duration: 1998 Jul 191998 Jul 24

Other

OtherProceedings of the 1998 11th International Vacuum Microelectronics Conference, IVMC
CityAsheville, NC, USA
Period98/7/1998/7/24

ASJC Scopus subject areas

  • Surfaces and Interfaces

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