Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

J. W. Jeong, B. K. Ju, D. J. Lee, Y. H. Lee, N. Y. Lee, Y. W. Ko, Y. G. Moon, D. J. Choi, M. H. Oh

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Tubeless packaging of field emission display using glass to glass electrostatic bonding technology'. Together they form a unique fingerprint.

Physics & Astronomy