Uniform-Field Over-Mode Waveguide for Spatial Power-Combining Applications

C. Yi, H. Lee, K. J. Lee, J. H. Joo, J. B. Kwon, Moonil Kim

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A new and effective millimeter-wave waveguide packaging technique suitable for 1-D spatial power-combining applications is presented. The transition structure using narrow corporate channels preserves the uniform field distribution when expanding the ${E}$ -plane width of a standard waveguide to several wavelengths. A Q-band test module, containing back-to-back transitions for an increased width from 2.84 to 52 mm, shows an average insertion loss of 0.34 dB in the 40-50-GHz range. The radiation patterns from an open-end module, cut in half from the original test module, confirm uniform field distribution across the over-mode guide aperture.

Original languageEnglish
Article number8125586
Pages (from-to)10-12
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume28
Issue number1
DOIs
Publication statusPublished - 2018 Jan 1

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Waveguides
modules
waveguides
Insertion losses
Millimeter waves
Packaging
insertion loss
packaging
Wavelength
millimeter waves
apertures
radiation
wavelengths

Keywords

  • Millimeter-wave power amplifiers
  • over-mode waveguide
  • spatial power combining

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Uniform-Field Over-Mode Waveguide for Spatial Power-Combining Applications. / Yi, C.; Lee, H.; Lee, K. J.; Joo, J. H.; Kwon, J. B.; Kim, Moonil.

In: IEEE Microwave and Wireless Components Letters, Vol. 28, No. 1, 8125586, 01.01.2018, p. 10-12.

Research output: Contribution to journalArticle

Yi, C. ; Lee, H. ; Lee, K. J. ; Joo, J. H. ; Kwon, J. B. ; Kim, Moonil. / Uniform-Field Over-Mode Waveguide for Spatial Power-Combining Applications. In: IEEE Microwave and Wireless Components Letters. 2018 ; Vol. 28, No. 1. pp. 10-12.
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