Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode

Hak Jong Choi, Soyoung Choo, Pil Hoon Jung, Ju Hyeon Shin, Yang Doo Kim, Heon Lee

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

Ag-nanomesh-based highly bendable conducting electrodes are developed using a combination of metal nanotransfer printing and embossing for the 6-inch wafer scale. Two Ag nanomeshes, including pitch sizes of 7.5 and 10 μm, are used to obtain highly transparent (approximately 85% transmittance at a wavelength of 550 nm) and electrically conducting properties (below 10 Ω sq-1). The Ag nanomeshes are also distinguished according to the fabrication process, which is called transferred or embedded Ag nanomesh on polyethylene terephthalate (PET) substrate, in order to compare their stability against bending stress. Then the enhancement of bending stability when the Ag nanomesh is embedded in the PET substrate is confirmed.

Original languageEnglish
Article number055305
JournalNanotechnology
Volume26
Issue number5
DOIs
Publication statusPublished - 2015 Jun 6

Fingerprint

Polyethylene Terephthalates
Silver
Polyethylene terephthalates
Electrodes
Printing
Substrates
Metals
Fabrication
Wavelength

Keywords

  • Ag nanomesh
  • Metal embedded structure
  • Metal network
  • Nanotransfer printing
  • Transparent conducting electrode

ASJC Scopus subject areas

  • Bioengineering
  • Chemistry(all)
  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)

Cite this

Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode. / Choi, Hak Jong; Choo, Soyoung; Jung, Pil Hoon; Shin, Ju Hyeon; Kim, Yang Doo; Lee, Heon.

In: Nanotechnology, Vol. 26, No. 5, 055305, 06.06.2015.

Research output: Contribution to journalArticle

Choi, Hak Jong ; Choo, Soyoung ; Jung, Pil Hoon ; Shin, Ju Hyeon ; Kim, Yang Doo ; Lee, Heon. / Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode. In: Nanotechnology. 2015 ; Vol. 26, No. 5.
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