Using on-chip event counters for high-resolution, real-time temperature measurement

Sung Woo Jung, Kevin Skadron

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Citations (Scopus)

Abstract

This paper proposes a technique to use on-chip event- or performance-counters to augment, or even replace, traditional analog CMOS temperature sensors. Using activity data from the performance counters, energy consumption that consequently causes heat dissipation can be tracked. Simple regression analysis permits us to find a relation between activity data and temperature. Performance counters already exist in many processors for debugging and performance characterization, require only minimal computation to interpret for temperature monitoring, and these calculations only need to operate at low frequency, so the marginal cost of this additional temperature-sensing capability is negligible. Performance counters monitor activity data (access count) of most on-chip functional units and therefore allow high-resolution, localized temperature sensing across a microprocessor. This in turn allows tracking of localized hotspots. Fine-grained, localized sensing is needed because different units can become hotspots depending on benchmarks. This is especially true if a malicious program intentionally induces high activity in a selected functional unit. This paper presents measurements from a commercial system to illustrate the accuracy of performance counters as additional temperature sensors.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Pages114-120
Number of pages7
Volume2006
DOIs
Publication statusPublished - 2006 Dec 22
Event10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 - San Diego, CA, United States
Duration: 2006 May 302006 Jun 2

Other

Other10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
CountryUnited States
CitySan Diego, CA
Period06/5/3006/6/2

Fingerprint

Time measurement
Temperature measurement
Temperature sensors
Temperature
Heat losses
Regression analysis
Microprocessor chips
Energy utilization
Monitoring
Costs

Keywords

  • Localized hotspot
  • Performance counter
  • Temperature measurement
  • Thermal management

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Jung, S. W., & Skadron, K. (2006). Using on-chip event counters for high-resolution, real-time temperature measurement. In Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (Vol. 2006, pp. 114-120). [1645330] https://doi.org/10.1109/ITHERM.2006.1645330

Using on-chip event counters for high-resolution, real-time temperature measurement. / Jung, Sung Woo; Skadron, Kevin.

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 2006 2006. p. 114-120 1645330.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jung, SW & Skadron, K 2006, Using on-chip event counters for high-resolution, real-time temperature measurement. in Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. vol. 2006, 1645330, pp. 114-120, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006, San Diego, CA, United States, 06/5/30. https://doi.org/10.1109/ITHERM.2006.1645330
Jung SW, Skadron K. Using on-chip event counters for high-resolution, real-time temperature measurement. In Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 2006. 2006. p. 114-120. 1645330 https://doi.org/10.1109/ITHERM.2006.1645330
Jung, Sung Woo ; Skadron, Kevin. / Using on-chip event counters for high-resolution, real-time temperature measurement. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Vol. 2006 2006. pp. 114-120
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