@inproceedings{c719f58136d2458294a8a889e646dfea,
title = "Vacuum packaging using anodic bonding and emission characteristics of FED",
abstract = "In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours.",
keywords = "Glass bonding, Leak test, Light emission, Packaged FED, Silicon film, Stability",
author = "Lee, {Duck Jung} and Ju, {Byeong Kwon} and Jeong, {Jee Won} and Hoon Kim and Jung, {Sung Jae} and Jin Jang and Oh, {Myung Hwan}",
note = "Funding Information: This research was supported by the Ministry of Science and Technology and the Ministry of Industry and Energy under Micromachinine Technology Development Program. Also, It was partially supported by the contract of KIST to KETVETRI under Grant No. KIST-2M07550. Publisher Copyright: {\textcopyright} 1999 SID Taipei Chapter.; 5th Asian Symposium on Information Display, ASID 1999 ; Conference date: 17-03-1999 Through 19-03-1999",
year = "1999",
doi = "10.1109/ASID.1999.762712",
language = "English",
series = "Proceedings of the 5th Asian Symposium on Information Display, ASID 1999",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "53--56",
editor = "Shieh, {Han-Ping D.} and I-Wei Wu",
booktitle = "Proceedings of the 5th Asian Symposium on Information Display, ASID 1999",
}