Vacuum packaging using anodic bonding and emission characteristics of FED

Duck Jung Lee, Byeong Kwon Ju, Jee Won Jeong, Hoon Kim, Sung Jae Jung, Jin Jang, Myung Hwan Oh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 μA. Emission stability was constantly measured for 11 hours.

Original languageEnglish
Title of host publicationProceedings of the 5th Asian Symposium on Information Display, ASID 1999
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages53-56
Number of pages4
ISBN (Electronic)9579734798, 9789579734790
DOIs
Publication statusPublished - 1999 Jan 1
Externally publishedYes
Event5th Asian Symposium on Information Display, ASID 1999 - Hsinchu, Taiwan, Province of China
Duration: 1999 Mar 171999 Mar 19

Other

Other5th Asian Symposium on Information Display, ASID 1999
CountryTaiwan, Province of China
CityHsinchu
Period99/3/1799/3/19

Fingerprint

Packaging
Vacuum
Glass
Glass bonding
Light emission
Amorphous silicon
Anodes
Silicon
Substrates

Keywords

  • Glass bonding
  • Leak test
  • Light emission
  • Packaged FED
  • Silicon film
  • Stability

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Media Technology

Cite this

Lee, D. J., Ju, B. K., Jeong, J. W., Kim, H., Jung, S. J., Jang, J., & Oh, M. H. (1999). Vacuum packaging using anodic bonding and emission characteristics of FED. In Proceedings of the 5th Asian Symposium on Information Display, ASID 1999 (pp. 53-56). [762712] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASID.1999.762712

Vacuum packaging using anodic bonding and emission characteristics of FED. / Lee, Duck Jung; Ju, Byeong Kwon; Jeong, Jee Won; Kim, Hoon; Jung, Sung Jae; Jang, Jin; Oh, Myung Hwan.

Proceedings of the 5th Asian Symposium on Information Display, ASID 1999. Institute of Electrical and Electronics Engineers Inc., 1999. p. 53-56 762712.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lee, DJ, Ju, BK, Jeong, JW, Kim, H, Jung, SJ, Jang, J & Oh, MH 1999, Vacuum packaging using anodic bonding and emission characteristics of FED. in Proceedings of the 5th Asian Symposium on Information Display, ASID 1999., 762712, Institute of Electrical and Electronics Engineers Inc., pp. 53-56, 5th Asian Symposium on Information Display, ASID 1999, Hsinchu, Taiwan, Province of China, 99/3/17. https://doi.org/10.1109/ASID.1999.762712
Lee DJ, Ju BK, Jeong JW, Kim H, Jung SJ, Jang J et al. Vacuum packaging using anodic bonding and emission characteristics of FED. In Proceedings of the 5th Asian Symposium on Information Display, ASID 1999. Institute of Electrical and Electronics Engineers Inc. 1999. p. 53-56. 762712 https://doi.org/10.1109/ASID.1999.762712
Lee, Duck Jung ; Ju, Byeong Kwon ; Jeong, Jee Won ; Kim, Hoon ; Jung, Sung Jae ; Jang, Jin ; Oh, Myung Hwan. / Vacuum packaging using anodic bonding and emission characteristics of FED. Proceedings of the 5th Asian Symposium on Information Display, ASID 1999. Institute of Electrical and Electronics Engineers Inc., 1999. pp. 53-56
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