Fingerprint
Dive into the research topics of 'Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes
Ho Young Kim, Chang Man Lim, Ki Seok Kim, Jeong Tak Oh, Hwan Hee Jeong, June O. Song, Tae Yeon Seong, Hiroshi Amano
Research output: Contribution to journal › Article › peer-review
4
Citations
(Scopus)