Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes

Ho Young Kim, Chang Man Lim, Ki Seok Kim, Jeong Tak Oh, Hwan Hee Jeong, June O. Song, Tae Yeon Seong, Hiroshi Amano

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science