FingerprintDive into the research topics of 'Via-hole-type flip-chip packaging to improve the thermal characteristics and reliability of blue light emitting diodes'. Together they form a unique fingerprint.
- Sort by
Ho Young Kim, Chang Man Lim, Ki Seok Kim, Jeong Tak Oh, Hwan Hee Jeong, June O. Song, Tae Yeon Seong, Hiroshi Amano
Research output: Contribution to journal › Article › peer-review