Wafer to wafer nano-imprinting lithography with monomer based thermally curable resin

Heon Lee, Gun Young Jung

Research output: Contribution to journalArticle

59 Citations (Scopus)

Abstract

Nano-imprinting lithography is one of the most promising key technologies for mass production of devices with nano-sized patterns. It is regarded as a tool for the next generation lithography (NGL). In this study, a thermally curable monomer solution was used for the imprinting process in order to lower imprinting pressure and temperature. A unique pressure vessel type imprinting system was used to imprint patterns as small as 150 nm over a whole 6 in. diameter wafer at a relatively low temperature (80 °C) and pressure (20 atm). Near zero residual layer under the trenches was successfully demonstrated over the whole 6 in. active area.

Original languageEnglish
Pages (from-to)168-174
Number of pages7
JournalMicroelectronic Engineering
Volume77
Issue number2
DOIs
Publication statusPublished - 2005 Feb 1

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resins
Lithography
lithography
Resins
monomers
Monomers
wafers
pressure vessels
Pressure vessels
low pressure
Temperature

Keywords

  • High fidelity pattern transfer
  • Pressurized chamber type imprinting system
  • Self-assembled monolayer
  • Thermal curing nano-imprinting lithography
  • Thermal curing resin
  • Zero residual layer

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics

Cite this

Wafer to wafer nano-imprinting lithography with monomer based thermally curable resin. / Lee, Heon; Jung, Gun Young.

In: Microelectronic Engineering, Vol. 77, No. 2, 01.02.2005, p. 168-174.

Research output: Contribution to journalArticle

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