WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array

Juhee Lee; Yangwoo Kim; Sanggeun Jeon; Moonily Kim

doi:10.3390/electronics11132091

WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array

Juhee Lee, Yangwoo Kim, Sanggeun Jeon, Moonily Kim

School of Electrical Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm² for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.

Original language	English
Article number	2091
Journal	Electronics (Switzerland)
Volume	11
Issue number	13
DOIs	https://doi.org/10.3390/electronics11132091
Publication status	Published - 2022 Jul 1

Keywords

integrated waveguide transition
spatial power combining
terahertz waveguide module

ASJC Scopus subject areas

Control and Systems Engineering
Signal Processing
Hardware and Architecture
Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.3390/electronics11132091

Cite this

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title = "WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array",

abstract = "The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm2 for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.",

keywords = "integrated waveguide transition, spatial power combining, terahertz waveguide module",

author = "Juhee Lee and Yangwoo Kim and Sanggeun Jeon and Moonily Kim",

note = "Funding Information: Funding: This work was supported by Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-IT2002-08. The chip fabrication was supported by the IC Design Education Center (IDEC), Korea. Publisher Copyright: {\textcopyright} 2022 by the authors. Licensee MDPI, Basel, Switzerland.",

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doi = "10.3390/electronics11132091",

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N1 - Funding Information: Funding: This work was supported by Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-IT2002-08. The chip fabrication was supported by the IC Design Education Center (IDEC), Korea. Publisher Copyright: © 2022 by the authors. Licensee MDPI, Basel, Switzerland.

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N2 - The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm2 for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.

AB - The performance of WR-3.4 overmoded waveguide modules containing a linear array of discrete terahertz integrated circuits is presented to verify a new power-combining technique. Custom-designed thru-line IC chips that include back-to-back broadband antenna transitions were fabricated with an area of 390 × 750 mm2 for waveguide packaging. Multiple array modules were assembled to verify the repeatability in performance. The array modules exhibited almost identical amounts of insertion losses compared with single-element modules, showing the best insertion loss of 2.6 dB over a 1 dB bandwidth of 95 GHz.

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WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array

Abstract

Keywords

ASJC Scopus subject areas

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