X- and ku-band amplifiers based on si/sige hbt's and micromachined lumped components

Jae Sung Rieh, Liang Hung Lu, Linda P.B. Katehi, Pallab Bhattacharya, Edward T. Croke, George E. Ponchak, Samuel A. Alterovitz

Research output: Contribution to journalArticle

52 Citations (Scopus)

Abstract

A double mesa-structure Si/SiGe heterqjunction bipolar transistor (HBT) and novel niicrornachined lumped passive components have been developed and successfully applied to the fabrication of X- and Ku-band monolithic amplifiers. The fabricated 5 × 5 μm2 emitter-size Si/SiGe HBT exhibited a de-current gain β of 109, and fT and fmax of 28 and 52 GHz, respectively. Micromachined spiral inductors demonstrated resonance frequency of 20 GHz up to 4 nH, which is higher than that of conventional spiral inductors by a factor of two. Single-, dual-, and three-stage X-band amplifiers have been designed, based on the extracted active- and passive-device model parameters. A single-stage amplifier exhibited a peak gain of 4.0 dB at 10.0 GHz, while dual- and three-stage versions showed peak gains of 5.7 dB at 10.0 GHz and 12.6 dB at 11.1 GHz, respectively. A Ku-band single-stage amplifier has also been designed and fabricated, showing a peak gain of 1.4 dB at 16.6 GHz. Matching circuits for all these amplifiers were implemented by lumped components, leading to a much smaller chip size compared to those employing distributed components as matching elements.

Original languageEnglish
Pages (from-to)685-694
Number of pages10
JournalIEEE Transactions on Microwave Theory and Techniques
Volume46
Issue number5 PART 2
DOIs
Publication statusPublished - 1998
Externally publishedYes

Keywords

  • Amplifier
  • HBT
  • MMIC
  • Micromachining
  • Resonance frequency
  • Sige

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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    Rieh, J. S., Lu, L. H., Katehi, L. P. B., Bhattacharya, P., Croke, E. T., Ponchak, G. E., & Alterovitz, S. A. (1998). X- and ku-band amplifiers based on si/sige hbt's and micromachined lumped components. IEEE Transactions on Microwave Theory and Techniques, 46(5 PART 2), 685-694. https://doi.org/10.1109/22.668683